375124B00032G
Heat Sink Passive BGA/FPGA Pin Array Adhesive 0.5°C/W Aluminum
Manufacturer:Boyd
Product Category:
Thermal Management, Heat Sinks
Avnet Manufacturer Part #: 375124B00032G
Secondary Manufacturer Part#: 375124B00032G
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RoHS 10 Compliant -
Tariff Charges
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| Tape | ||
| BGA|FPGA | ||
| Pin Array | ||
| Aluminum | ||
| Adhesive | ||
| 40 x 40 x 25 mm | ||
| 3751 | ||
| 0.5 °C/W | ||
| Passive |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8542900000 |
| Schedule B: | 8542900000 |
Factory Lead Time: