341900F00000G
Heat Sink Spreader BGA/PGA/QFP Thin Copper
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Manufacturer:Boyd
Product Category:
Thermal Management, Heat Sinks
Avnet Manufacturer Part #: 341900F00000G
Secondary Manufacturer Part#: 022923
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RoHS 10 Compliant -
Tariff Charges
When space is at a premium, Aavid’s Thin-fin heat sinks reduce package case temperature by as much as 20ºC. These flexible, copper spreaders attach to the electronic package using pre-applied adhesive, providing an off-theshelf solution for PCI and AGP chip sets. A laminated dielectric coating prevents shorting, making the Thin-Fin ideal for BGA devices and multimedia applications.
Offer significant cooling with limited headroom • Pre-applied adhesive for rapid assembly • Dielectric coating prevents shorting • Fits many IC package styles<CRLF>
Technical Attributes
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| Description | Value | |
|---|---|---|
| Adhesive | ||
| Matte Tin | ||
| Copper | ||
| 76.2 x 25.4 mm |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | NO RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 7604295090 |
| Schedule B: | 7604295090 |
Factory Lead Time: