2292BG
Heat Sink Passive BGA Radial
- RoHS 10 Compliant
- Tariff Charges
Bond-on heat sink for leadless chip carriers and flat packs.Primarily designed for 68-position devices.
Width: 28.58
Length: 28.58
Height: 0.00
Finish: Black Anodize
Technical Attributes
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| Description | Value | |
|---|---|---|
| Matte Tin |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | NO RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8541900000 |
| Schedule B: | 8541900000 |