10-6327-01G
Heat Sink Passive BGA Pin Array Push Pin 30.6°C/W Black Anodized
- RoHS 10 Compliant
- Tariff Charges
Pin Fin heat sink with Push Pin attachment
Simple tool-free installation
Springs maintain constant and uniform pressure to ensure reliable thermal contact
Mechanical attachment provides secure mounting where vibration is a concern
Fits industry Standard Hole patterns
Accommodates up to 4mm stack height (typical 1.5mm PCB and 2.5 mm BGA package)Note: Part should be orientated to allow airflow through hollow channel
Technical Attributes
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| Description | Value | |
|---|---|---|
| Push Pin | ||
| 28.5 x 28.5 x 10 mm | ||
| 30.6 °C/W |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8414591500 |
| Schedule B: | 8414599080 |