10-5607-04G
Heat Sink Passive BGA/FPGA Square PCB Mount 0.05°C/W Aluminum
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Manufacturer:Boyd
Product Category:
Thermal Management, Heat Sinks
Avnet Manufacturer Part #: 10-5607-04G
Secondary Manufacturer Part#: 300867
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RoHS 10 Compliant -
Tariff Charges
Square heat sink with Push Pin attachment
Simple tool-free installation
Springs maintain constant and uniform pressure to ensure reliable thermal contact
Mechanical attachment provides secure mounting where vibration is a concern
Fits industry Standard Hole patterns
Accommodates up to 4mm stack height (typical 1.5mm PCB and 2.5 mm BGA package)Note: Part should be orientated to allow airflow through hollow channel
Technical Attributes
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| Description | Value | |
|---|---|---|
| Push Pin | ||
| BGA|FPGA | ||
| Square | ||
| Matte Tin | ||
| Aluminum | ||
| PCB Mount | ||
| 37.4 x 37.4 x 10 mm | ||
| 0.05 °C/W | ||
| Passive |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8419505000 |
| Schedule B: | 8419500000 |
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