AES-MAAXB-8ULP-SOM-G

The 8ULP SOM is a compact (43mm x 36mm), ultra-low power, peripheral-rich, compute module, designed for ntegration onto custom OEM hardware.

The NXP i.MX 8ULP device on this SOM is architected for optimal power efficiency, with separated processing domains, e.g. Application domain with two Arm® Cortex®-A35 cores plus 3D/2D GPUs (plus comprehensive Linux enablement for rich GUI applications) Real Time domain with Arm Cortex-M33F core for real-time performance, plus Cadence Fusion F1 DSP core for low-power audio/voice use cases. LPAV domain (Low Power Audio Video) with a Cadence Tensilica HiFi 4 DSP core for advanced audio, ML and sensor applications.

An EdgeLock Security Enclave and µPower Manager include RISC-V cores to manage advanced security features and govern over 20 different power mode configurations across the processing domains. Together with the onboard NXP PCA9460B PMIC, exceptional energy efficiency is achieved.

Memory resources include OCRAM (896 KB), x32bit LPDDR4X DDR (2 GB), 8bit PSRAM (8 MB), eMMC 5.1 flash (32GB) and 8bit SPI NOR flash (4 MB).

Board to board interface is via two 100pin (0.4 mm pitch) connectors that can accommodate different stacking heights and have mating connectors from both Samtec and TE Connectivity.

The compact SOM dimensions, energy-efficient multi-processor architecture, EdgeLock security, graphic capabilities and rich peripheral mix, all add-up to a versatile intelligent edge solution.