SOFTFLEX-B016-20-01-0762-0762

The SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides exceptional contouring and excellent cushioning performance. These defining features ensure that SoftFlex Gap Fillers are ideal for dealing with uneven surfaces, parts with varying heights and devices that require greater flexibility in design, all the while reducing overall stress to the PCB and eliminating tolerances.

• High Thermal Conductivity
• Reduced Thermal Resistance
• Wide Range of Hardness
• Flexible, Easy Contouring
• Single & Double Sided Adhesion
• Decreased Strain
• Puncture, Shear and Tear Resistant
• Thermal Conductivity (W/mK): 1.6