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XCZU6EG-2FFVC900I

FPGA Zynq UltraScale+ Family 469446 Cells 20nm Technology 0.85V 900-Pin FC-BGA Tray

Manufacturer:AMD
Product Category: Programmable Logic, FPGAs
Avnet Manufacturer Part #: XCZU6EG-2FFVC900I
Secondary Manufacturer Part#: XCZU6EG-2FFVC900I
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The Xilinx® UltraScale™ architecture is the first ASIC-class All Programmable architecture to enable multi-hundred gigabit-per-second levels of system performance with smart processing, while efficiently routing and processing data on-chip. UltraScale architecture-based devices address a vast spectrum of high-bandwidth, high-utilization system requirements by using industry-leading technical innovations, including next-generation routing, ASIC-like clocking, 3D-on-3D ICs, multiprocessor SoC (MPSoC) technologies, and new power reduction features. The devices share many building blocks, providing scalability across process nodes and product families to leverage system-level investment across platforms.

Virtex® UltraScale+™ devices provide the highest performance and integration capabilities in a FinFET node, including both the highest serial I/O and signal processing bandwidth, as well as the highest on-chip memory density. As the industry's most capable FPGA family, the Virtex UltraScale+ devices are ideal for applications including 1+Tb/s networking and data center and fully integrated radar/early-warning systems.

Virtex UltraScale devices provide the greatest performance and integration at 20 nm, including serial I/O bandwidth and logic capacity. As the industry's only high-end FPGA at the 20 nm process node, this family is ideal for applications including 400G networking, large scale ASIC prototyping, and emulation.

Kintex® UltraScale+ devices provide the best price/performance/watt balance in a FinFET node, delivering the most cost-effective solution for high-end capabilities, including transceiver and memory interface line rates as well as 100G connectivity cores. Our newest mid-range family is ideal for both packet processing and DSP-intensive functions and is well suited for applications including wireless MIMO technology, Nx100G networking, and data center.

Technical Attributes

Find Similar Parts

Description Value
FCBGA
Surface Mount
469, 446
900
204
100 °C
-40 °C

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: 5A992.C
HTSN: 8542390090
Schedule B: 8542390060
In Stock :  0
Additional inventory
Factory Lead Time: 280 Weeks
Price for: Each
Quantity:
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$3910.34