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EK-U1-ZCU670-V2-G

Evaluation Kit, XCZU67DR-2FSVE1156I, 32 / 64bit, ARM Cortex-A53 / Cortex-R5

Manufacturer:AMD
Avnet Manufacturer Part #: EK-U1-ZCU670-V2-G
Secondary Manufacturer Part#: EK-U1-ZCU670-V2-G
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EK-U1-ZCU670-V2-G is an AMD Zynq™ UltraScale+™ RFSoC DFE ZCU670 evaluation kit. This is optimal platform for adaptive radio development and out-of-box evaluation in rapid prototyping of 5G New Radio (5G NR), radar and a breadth of RF applications. As an adaptive SoC, the device features programmable logic for hardware differentiation and adaptability to future market requirements. The ZCU670 is an evaluation board featuring the ZU67DR Zynq® UltraScale+™ RFSoC DFE device. This board enables the evaluation of applications requiring multi-band, multi-std, multi-mode radios, including Milcom and Satcom applications. The ZCU670 board is equipped with all the common board-level features needed for design development, such as DDR4 memory, networking interfaces, an FMC+ expansion port, as well as access to the RFMC 2.0 interface. Suitable for wireless: 5G massive-MIMO, multi-mode macrocell, mmWave radio as IF transceiver, small cell nodes, aerospace & defence, test & measurement applications.

  • A monolithic, analogue, and digital device based on 16nm TSMC process
  • Integrated 8T8R RF data converters for 7.125GHz direct-RF bandwidth and 400MHz iBW
  • Power-optimized 5G NR cores including DUC, DDC, DPD, CFR, and low-PHY processing IP
  • UltraScale+ programmable logic for H/W differentiation, adaptability to future market requirements
  • Arm® processing subsystem for RF calibration, DPD processing and more
  • DDR4 component - 4GB, 64-bit, 2666MT/s, connectivity to programmable logic (PL)
  • DDR4 SODIMM -4GB 64-bit, 2400MT/s, connectivity to processing subsystem (PS)
  • Quad zSFP/zSFP+ cage assembly, XM650 RFMC 2.0 card for N79 band loopback
  • FMC+ CONN enabling I/O expansion, connectivity to 34 differential I/O, 12x 32Gb/s transceiver I/O
  • XM755 RFMC 2.0 breakout card for in-depth lab measurements, including multi-tile synchronization

Technical Attributes

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Description Value
No
Processors Tools
4GB QSPI
Yes
No
I2C|JTAG|PMBus|USB|UART
ZCU670 Board, Add-On Card, 8x Filters, Cable Assemblies, Micro USB/SMA/Ethernet Cable, Power Cord
Micro SD
4 GB
DDR4
271.15 x 310.52 x 3.02 mm
Evaluation Kit
USB 3.0

ECCN / UNSPSC / COO

Description Value
Country of Origin: NO RECOVERY FEE
ECCN: 3A002.H
HTSN: 8471500150
Schedule B: 8471500110
In Stock :  0
Additional inventory
Factory Lead Time: 56 Weeks
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$18136.6