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AS4C32M16D3L-12BCN

DRAM Chip DDR3L SDRAM 512M-Bit 32M X 16 1.35V 96-Pin FBGA Tray

Manufacturer:Alliance Memory
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: AS4C32M16D3L-12BCN
Secondary Manufacturer Part#: AS4C32M16D3L-12BCN
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The AS4C32M16D1 is a high-speed CMOS double data rate synchronous DRAM containing 512 Mbits. It is internally configured as a quad 8M x 16 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CK). Data outputs occur at both rising edges of CK and CK . Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a BankActivate command which is then followed by a Read or Write command. The device provides programmable Read or Write burst lengths of 2, 4, or 8. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The refresh functions, either Auto or Self Refresh are easy to use. In addition, 512Mb DDR features programmable DLL option. By having a programmable mode register and extended mode register, the system can choose the most suitable modes to maximize its performance. These devices are well suited for applications requiring high memory band width; result in a device particularly well suited to high performance main memory and graphics applications.

  • Fast clock rate: 200MHz
  • Differential Clock CK & CK
  • Bi-directional DQS
  • DLL enable/disable by EMRS
  • Fully synchronous operation
  • Internal pipeline architecture
  • Four internal banks, 8M x 16-bit for each bank
  • Programmable Mode and Extended Mode registers
    • CAS Latency: 2, 2.5, 3
    • Burst length: 2, 4, 8
    • Burst Type: Sequential & Interleaved
  • Individual byte write mask control
  • DM Write Latency = 0
  • Auto Refresh and Self Refresh
  • 8192 refresh cycles / 64ms
  • Precharge & active power down
  • Power supplies: VDD & VDDQ = 2.5V ± 0.2V
  • Operating temperature range
    • Commercial (0° ~ 70°C)
    • Industrial (-40° ~ 85°C)
  • Interface: SSTL_2 I/O Interface
  • Package: 60-Ball, 8x13x1.2 mm (max) TFBGA
    • Pb free and Halogen Free

Technical Attributes

Find Similar Parts

Description Value
13 Bit
800 MHz
16 Bit
512 MB
DDR3L SDRAM
FBGA
Surface Mount
260 °C
800 MHz
72 mA
20 ns
32M x 16bit
512 Mbit
Surface Mount
MSL 3 - 168 hours
96
8
16 Bit
16 Bit
2.7, 5.5 V
0 to 95 °C
95 °C
0 °C
32M x 16
96FBGA
96
8 x 13 x 0.6(Max) mm
Commercial
FBGA
1.35 V
DDR3L SDRAM

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 8542320028
Schedule B: 8542320040
In Stock :  0
Additional inventory
Factory Lead Time: 56 Weeks
Price for: Each
Quantity:
Min:190  Mult:190  
USD $:
190+
$4.08514
5130+
$3.94
10260+
$3.92
20520+
$3.9
41040+
$3.88