AS4C32M16D2-25BCNTR
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin TFBGA T/R
- RoHS 10 Compliant
- Tariff Charges
The AS4C32M16D2 DDR2 SDRAM is a high-speed CMOSDouble-Data-Rate-Two (DDR2), synchronous dynamicrandom-access memory (SDRAM) containing 512 Mbits ina 16-bit wide data I/Os. It is internally configured as a quadbank DRAM, 4 banks x 8Mb addresses x 16 I/OsThe device is designed to comply with DDR2 DRAM keyfeatures such as posted CAS# with additive latency, Writelatency = Read latency -1, Off-Chip Driver (OCD) impedanceadjustment, and On Die Termination(ODT).All of the control and address inputs are synchronizedwith a pair of externally supplied differential clocks. Inputsare latched at the cross point of differential clocks (CKrising and CK# falling)All I/Os are synchronized with a pair of bidirectionalstrobes (DQS and DQS#) in a source synchronous fashion.The address bus is used to convey row, column, and bankaddress information in RAS #, CAS# multiplexing style. Accesses begin with theregistration of a Bank Activate command, and then it isfollowed by a Read or Write command. Read and writeaccesses to the DDR2 SDRAM are 4 or 8-bit burst oriented;accesses start at a selected location and continue for aprogrammed number of locations in a programmedsequence. Operating the four memory banks in aninterleaved fashion allows random access operation tooccur at a higher rate than is possible with standardDRAMs. An auto precharge function may be enabled toprovide a self-timed row precharge that is initiated at theend of the burst sequence. A sequential and gapless datarate is possible depending on burst length, CAS latency,and speed grade of the device.
- JEDEC Standard Compliant
- JEDEC standard 1.8V I/O (SSTL_18
- compatible)
- Power supplies: VDD & VDDQ = +1.8V ? 0.1V
- Supports JEDEC clock jitter specification
- Fully synchronous operation
- Fast clock rate: 400 MHz
- Differential Clock, CK & CK#
- Bidirectional single/differential data strobe
- DQS & DQS#
- 4 internal banks for concurrent operation
- 4
- bit prefetch architecture
- Internal pipeline architecture
- Precharge & active power down
- Programmable Mode & Extended Mode registers
- Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5, 6
- WRITE latency = READ latency
- 1 tCK
- Burst lengths: 4 or 8
- Burst type: Sequential / Interleave
- DLL enable/disable
- Off
- Chip Driver (OCD)
- Impedance Adjustment
- Adjustable data
- output drive strength
- On
- d
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| 13 Bit | ||
| 400 MHz | ||
| 16 Bit | ||
| 512 Mbit | ||
| DDR2 SDRAM | ||
| 260 | ||
| 400 MHz | ||
| 85 mA | ||
| 0.4 ns | ||
| 512 Mbit | ||
| Surface Mount | ||
| 84 | ||
| 4 | ||
| 16 Bit | ||
| 16 Bit | ||
| 4.75, 5.25 V | ||
| 0 to 70 °C | ||
| 70 °C | ||
| 0 °C | ||
| 32M x 16 | ||
| 84TFBGA | ||
| 84 | ||
| 8 x 12.5 x 0.8 | ||
| Commercial | ||
| TFBGA | ||
| 1.8 V | ||
| DDR2 SDRAM |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8542320041 |
| Schedule B: | 8542320040 |