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AS4C32M16D2-25BCNTR

DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin TFBGA T/R

Manufacturer:Alliance Memory
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: AS4C32M16D2-25BCNTR
Secondary Manufacturer Part#: AS4C32M16D2-25BCNTR
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The AS4C32M16D2 DDR2 SDRAM is a high-speed CMOSDouble-Data-Rate-Two (DDR2), synchronous dynamicrandom-access memory (SDRAM) containing 512 Mbits ina 16-bit wide data I/Os. It is internally configured as a quadbank DRAM, 4 banks x 8Mb addresses x 16 I/OsThe device is designed to comply with DDR2 DRAM keyfeatures such as posted CAS# with additive latency, Writelatency = Read latency -1, Off-Chip Driver (OCD) impedanceadjustment, and On Die Termination(ODT).All of the control and address inputs are synchronizedwith a pair of externally supplied differential clocks. Inputsare latched at the cross point of differential clocks (CKrising and CK# falling)All I/Os are synchronized with a pair of bidirectionalstrobes (DQS and DQS#) in a source synchronous fashion.The address bus is used to convey row, column, and bankaddress information in RAS #, CAS# multiplexing style. Accesses begin with theregistration of a Bank Activate command, and then it isfollowed by a Read or Write command. Read and writeaccesses to the DDR2 SDRAM are 4 or 8-bit burst oriented;accesses start at a selected location and continue for aprogrammed number of locations in a programmedsequence. Operating the four memory banks in aninterleaved fashion allows random access operation tooccur at a higher rate than is possible with standardDRAMs. An auto precharge function may be enabled toprovide a self-timed row precharge that is initiated at theend of the burst sequence. A sequential and gapless datarate is possible depending on burst length, CAS latency,and speed grade of the device.

  • JEDEC Standard Compliant
  • JEDEC standard 1.8V I/O (SSTL_18
    • compatible)
  • Power supplies: VDD & VDDQ = +1.8V ? 0.1V
  • Supports JEDEC clock jitter specification
  • Fully synchronous operation
  • Fast clock rate: 400 MHz
  • Differential Clock, CK & CK#
  • Bidirectional single/differential data strobe
    • DQS & DQS#
  • 4 internal banks for concurrent operation
  • 4
    • bit prefetch architecture
  • Internal pipeline architecture
  • Precharge & active power down
  • Programmable Mode & Extended Mode registers
  • Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5, 6
  • WRITE latency = READ latency
    • 1 tCK
  • Burst lengths: 4 or 8
  • Burst type: Sequential / Interleave
  • DLL enable/disable
  • Off
    • Chip Driver (OCD)
    • Impedance Adjustment
    • Adjustable data
    • output drive strength
  • On
    • d

Technical Attributes

Find Similar Parts

Description Value
13 Bit
400 MHz
16 Bit
512 Mbit
DDR2 SDRAM
260
400 MHz
85 mA
0.4 ns
512 Mbit
Surface Mount
84
4
16 Bit
16 Bit
4.75, 5.25 V
0 to 70 °C
70 °C
0 °C
32M x 16
84TFBGA
84
8 x 12.5 x 0.8
Commercial
TFBGA
1.8 V
DDR2 SDRAM

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 8542320041
Schedule B: 8542320040
In Stock :  0
Additional inventory
Factory Lead Time: 372 Weeks
Price for: Each
Quantity:
Min:1000  Mult:1000  
USD $: