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AS4C256M16D4-83BCN

DRAM Chip DDR4 SDRAM 4Gbit 256M X 16 1.2V 96-Pin FBGA

Manufacturer:Alliance Memory
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: AS4C256M16D4-83BCN
Secondary Manufacturer Part#: AS4C256M16D4-83BCN
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

AS4C256M16D4-83BCN is a 256M x 16bit DDR4 synchronous DRAM (SDRAM). The DDR4 SDRAM is a high-speed dynamic random-access memory internally organized with eight-banks (2 bank groups each with 4 banks). The DDR4 SDRAM uses a 8n prefetch architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR4 SDRAM consists of a single 8n-bit wide, four clock data transfer at the internal DRAM core and eight corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write operation to the DDR4 SDRAM are burst oriented, start at a selected location, and continue for a burst length of eight or a ‘chopped’ burst of four in a programmed sequence. Operation begins with the registration of an activate command, which is then followed by a read or write command.

  • JEDEC standard compliant, supports JEDEC clock jitter specification, auto refresh and self refresh
  • Power supplies: VDD and VDDQ = +1.2V ±0.06V, VPP = +2.5V -0.125V / +0.25V
  • Bidirectional differential data strobe, DQS &DQS#, differential clock, CK and CK#
  • 8 internal banks: 2 groups of 4 banks each, separated IO gating structures by bank group
  • 8n-bit prefetch architecture, precharge and active power down, auto refresh and self refresh
  • Low-power auto self refresh (LPASR), self refresh abort, fine granularity refresh
  • Write levelling, DQ training via MPR, command/address (CA) parity, boundary scan mode
  • Per DRAM addressability (PDA), output driver impedance control, dynamic on-die termination (ODT)
  • ZQ calibration, command/address latency (CAL), asynchronous reset, DLL enable/disable
  • 1200MHz max clock, 96-ball FBGA package, commercial (extended) temperature range from 0 to 95°C

Technical Attributes

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Description Value
17 Bit
1.2 GHz
16 Bit
4 Gbit
DDR4 SDRAM
FBGA
Surface Mount
1200 MHz
128 mA
18 ns
256M x 16bit
4 Gbit
Surface Mount
96
8
16 Bit
16 Bit
2.3, 5.5 V
0 to 95 °C
95 °C
0 °C
256M x 16
96FBGA
96
7.5 x 13.5 x 1.2 mm
Commercial
FBGA
1.2 V
DDR4 SDRAM

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 8542320036
Schedule B: 8542320050
In Stock :  0
Additional inventory
Factory Lead Time: 372 Weeks
Price for: Each
Quantity:
Min:209  Mult:209  
USD $: