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AXP-R-FILL-PANEL

Blank Filler Rear Panel for AXP1620/AXP1440/AXP1410 Embedded Power

Manufacturer:Advanced Energy
Avnet Manufacturer Part #: AXP-R-FILL-PANEL
Secondary Manufacturer Part#: AXP-R-FILL-PANEL
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The Emerson Network Power Centellis 2000 platform core is a high availability platform ideally suited for data intensive, central office and enterprise networking applications. The low profile makes the Centellis 2000 the optimal candidate for distributed networking functions, low density subscriber areas, or specialized applications. Target applications include distributed control plane functions, IMS/IPTV subsystems, 4G wireless applications, and edge networking and routing. This compact platform integrates chassis, cooling, power distribution and shelf management into an off-the-shelf solution for small and medium size network element deployments. The small form factor AdvancedTCA chassis enables reuse of existing, larger scale AdvancedTCA (ATCA) hardware and software elements providing a significant reduction in development cost and reducing time-to-market for deployments. The Centellis 2000 is available in simplex and duplex configurations with regard to power, shelf management and base interface switching. Further flexibility is achieved by offering both DC or AC power input modules. Future blade bandwidth requirements are addressed with a sophisticated 1G/10G/40G capable fabric cross-connect backplane. This will allow the simple upgrade of 40G ATCA blades when available without a chassis fork-lift upgrade. Designed to meet NEBS and ETSI environmental requirements, the Centellis 2000 features front-to-rear cooling, and is designed to meet the stringent Communications Platform Trade Association (CP-TA) B.4 thermal profile. This superior cooling performance enables any combination of ATCA blades and rear transition modules (RTMs) within the ATCA specification limits. New for the Centellis 2000, R3.0 is the MF106 - a substantial upgrade to the shelf management module. Improvements include a more powerful processor, additional boot, SDRAM and user memory, and an updated Linux kernel. Also included in the new MF106 shelf management module is a fully manageable, int

  • Two-slot, 3U, 19” form factor (horizontal slots)
  • Targeted for central office and data center environments
  • Upgraded Shelf Management
  • Front-to-rear cooling - CP-TA B.4 compliant
  • Integrated shelf management and Base switching infrastructure
  • Direct cross-connect circuitry for the Fabric Interface (1G/10G/40G)
  • AC and DC power configurations available
  • Simplex and duplex configurations available
  • Two user slots for OEM customization
  • RoHS 6/6 compliant
  • Designed for NEBS/ETSI compliance (DC variants only)

Technical Attributes

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Description Value
AXP1620/AXP1440/AXP1410 Embedded Power
Blank Filler Panel

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 8473305100
Schedule B: 8473300002
In Stock :  0
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Factory Lead Time: 252 Weeks
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