MT47H128M8SH-25E IT:M | Micron DRAM | Avnet Asia Pacific

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MT47H128M8SH-25E IT:M

DRAM Chip DDR2 SDRAM 1G-Bit 128M x 8 1.8V 60-Pin FBGA

MT47H128M8SH-25E IT:M | DRAM | Micron
Micron
製造商: Micron
產品分類: 記憶體, DRAM
替代料號: MT47H128M8SH-25E IT:M
RoHS 6 Compliant

The DDR2 SDRAM uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O balls. A single read or write access for the DDR2 SDRAM effectively consists of a single 4n-bit-wide, one clock- cycle data transfer at the internal DRAM core and four corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O balls. A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM during READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs. The x16 offering has two data strobes, one for the lower byte (LDQS, LDQS#) and one for the upper byte (UDQS, UDQS#). The DDR2 SDRAM operates from a differential clock (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS as well as to both edges of CK. Read and write accesses to the DDR2 SDRAM are burst-oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVATE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVATE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and the starting column location for the burst access. The DDR2 SDRAM provides for programmable read or write burst lengths of four or eight locations. DDR2 SDRAM supports interrupting a burst read of eight with another read or a burst write of eight with another write. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst access. As with standard DDR SDRAM, the pipelined, multibank architecture of DDR2 SDRAM enables concurrent operation, thereby providing high, effective bandwidth by hiding row precharge and activation time. A self refresh mode is provided, along with a power-saving, power-down mode. All inputs are compatible with the JEDEC standard for SSTL_18. All full drive-strength outputs are SSTL_18-compatible.

技術參數

  • VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
  • JEDEC-standard 1.8V I/O (SSTL_18-compatible)
  • Differential data strobe (DQS, DQS#) option
  • 4n-bit prefetch architecture
  • Duplicate output strobe (RDQS) option for x8
  • DLL to align DQ and DQS transitions with CK
  • 8 internal banks for concurrent operation
  • Programmable CAS latency (CL)
  • Posted CAS additive latency (AL)
  • WRITE latency = READ latency - 1 tCK
  • Selectable burst lengths (BL): 4 or 8
  • Adjustable data-output drive strength
  • 64ms, 8192-cycle refresh
  • On-die termination (ODT)
  • Industrial temperature (IT) option
  • Automotive temperature (AT) option
  • RoHS-compliant
  • Supports JEDEC clock jitter specification

技術屬性

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描述
集成電路外殼/封裝 FBGA
集成電路貼裝 Surface Mount
存儲密度 1 Gbit
存儲器配置 128M x 8
最高工作溫度 95 °C
引腳數 60
最低工作溫度 -40 °C
額定電源電壓 1.8 V
時鐘頻率最大值 400 MHz
DRAM類型 DDR2 SDRAM

ECCN/UNSPSC

描述
ECCN: EAR99
計劃交貨期 B: PARTS...
HTSN: PARTS...

文件

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文檔

標題 下載 類別 發布日期
MIC4-MICT-N-A0001987348-1 PCN EOL-Documentation 20160109
MIC4-MIC_31901 PCN EOL-Documentation 20160109
MIC4-MICT-N-A0001987348-1 PCN Other-Documents 20160109
MIC4-MIC_31901 PCN Other-Documents 20160109
MIC4-PCN_31901 PCN EOL-Documentation 20160109
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