制造商:
TE Connectivity
闲置警告对话框
The M.2 (Next Generation Form Factor) product line is a natural transition from the Mini Card and Half Mini Card to a smaller form factor in both size and volume. It supports multiple function add-in cards / modules including: WiFi, Bluetooth, Global Navigation Satellite Systems, Near Field Communication, Hybrid Digital Radio, Wireless Gigabit Alliance (WiGig), Wireless Wide Area Network and Solid-State Storage Devices. It also adds functionality to PCIe Gen 3, SATA 3, SATA I/O and USB 3. The new smaller form factor is suitable for applications in new thin platforms.
技术参数
|
描述 | 值 |
---|---|---|
|
工作温度 | -40 to 85 °C |
|
触点材料 | Copper Alloy |
|
Maximum Contact Resistance | 55 mOhm |
|
最大额定电压 | 50 |
|
安装 | Surface Mount |
|
类型 | Power Card Edge |
|
Number of Rows | 2 |
|
Base/Housing Material | High Temperature Thermoplastic |
|
触点电镀 | Gold Over Nickel |
|
Number of Contacts | 67 |
|
产品尺寸 | 21.9 x 7.75 x 3.2 mm |
|
Maximum Current Rating/Contact | 500 mA |
|
Body Orientation | Right Angle |
|
引脚数 | 67 |
|
Housing Color | Black |
|
铅完成 | Matte Tin over Nickel |
|
终止方法 | Solder |
|
额定电压 | 50 Vac |
|
最高加工温度 | 245 °C |
|
Pitch | 0.5 mm |
描述 | 值 |
---|---|
ECCN: | EAR99 |
计划交货期 B: | PARTS... |
HTSN: | PARTS... |