制造商:
Molex
45984-0111
Conn Wire to Board RCP 12 POS 1.27mm Solder RA Thru-Hole Tray
安富利制造商模型#:
0459840111
RoHS 10 Compliant
NCNR
Conn Wire to Board RCP 12 POS 1.27mm Solder RA Thru-Hole Tray
技术特性
查找类似的料号|
|
描述 | 值 |
|---|---|---|
|
|
极性 | RCP |
|
|
铅完成 | Tin over Nickel |
|
|
额定电压 | 250 |
|
|
Housing Color | Black |
|
|
终止方法 | Solder |
|
|
触点电镀 | Gold Over Nickel |
|
|
Body Orientation | Right Angle |
|
|
最高加工温度 | 260 °C |
|
|
工作温度 | -40 to 105 °C |
|
|
Pitch | 1.2700 mm |
|
|
产品长度 | 11.5 |
|
|
类型 | Wire to Board |
|
|
Maximum Contact Resistance | 15 mOhm |
|
|
Base/Housing Material | LCP (Liquid Crystal Polymer) |
|
|
安装 | Through Hole |
|
|
Number of Rows | 2 |
|
|
Number of Contacts | 12 POS |
|
|
产品尺寸 | 11.5 x 15.7 x 7.5 |
|
|
引脚数 | 12 |
|
|
触点材料 | Copper Alloy |
ECCN / UNSPSC
| 描述 | 值 |
|---|---|
| ECCN: | EAR99 |
| 计划交货期 B: | 8536.69.40.40 |
| HTSN: | 8536.69.40.40 |