EM6GC16EWXC-12H | Etron Technology DRAM | Avnet Asia Pacific

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EM6GC16EWXC-12H

DRAM Chip DDR3 SDRAM 1G-Bit 64Mx16 1.5V 96-Pin F-BGA

Etron Technology
制造商: Etron Technology
产品分类: 内存, DRAM
安富利制造商模型#: EM6GC16EWXC-12H
RoHS 6 Compliant

The 1Gb Double-Data-Rate-3 DRAMs is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAM.

The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. These synchronous devices achieve high speed double-data-rate transfer rates of up to 1866 Mb/sec/pin for general applications.

The chip is designed to comply with all key DDR3 DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pair in a source synchronous fashion.

These devices operate with a single 1.5V ± 0.075V power supply and are available in BGA packages.

技术参数

  • JEDEC Standard Compliant
  • Power supplies: VDD & VDDQ = +1.5V ± 0.075V
  • Industrial temperature: TC = -40~95°C
  • Supports JEDEC clock jitter specification
  • Fully synchronous operation
  • Fast clock rate: 667/800/933MHz
  • Differential Clock, CK & CK#
  • Bidirectional differential data strobe
    • DQS & DQS#
  • 8 internal banks for concurrent operation
  • 8n-bit prefetch architecture
  • Pipelined internal architecture
  • Precharge & active power down
  • Programmable Mode & Extended Mode registers
  • Additive Latency (AL): 0, CL-1, CL-2
  • Programmable Burst lengths: 4, 8
  • Burst type: Sequential / Interleave
  • Output Driver Impedance Control
  • 8192 refresh cycles / 64ms
    • Average refresh period
    • 7.8µs @ -40°C ≦TC≦ +85°C
    • 3.9µs @ +85°C <TC≦ +95°C
  • Write Leveling
  • ZQ Calibration
  • Dynamic ODT (Rtt_Nom & Rtt_WR)
  • RoHS compliant
  • Auto Refresh and Self Refresh
  • 96-ball 9 x 13 x 1.2mm FBGA package
    • Pb and Halogen Free

技术特性

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描述
最低工作温度 0 °C
集成电路外壳/封装 FBGA
DRAM类型 DDR3 SDRAM
最高工作温度 85 °C
集成电路安装 Surface Mount
存储密度 1 Gbit
存储器配置 64M x 16bit
时钟频率最大值 800 MHz
引脚数 96

ECCN / UNSPSC

描述
ECCN: EAR99
计划交货期 B: PARTS...
HTSN: PARTS...
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