闲置警告对话框
The 1Gb Double-Data-Rate-3 DRAMs is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAM.
The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. These synchronous devices achieve high speed double-data-rate transfer rates of up to 1866 Mb/sec/pin for general applications.
The chip is designed to comply with all key DDR3 DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pair in a source synchronous fashion.
These devices operate with a single 1.5V ± 0.075V power supply and are available in BGA packages.
技术参数
|
描述 | 值 |
---|---|---|
|
最低工作温度 | 0 °C |
|
集成电路外壳/封装 | FBGA |
|
DRAM类型 | DDR3 SDRAM |
|
最高工作温度 | 85 °C |
|
集成电路安装 | Surface Mount |
|
存储密度 | 1 Gbit |
|
存储器配置 | 64M x 16bit |
|
时钟频率最大值 | 800 MHz |
|
引脚数 | 96 |
描述 | 值 |
---|---|
ECCN: | EAR99 |
计划交货期 B: | PARTS... |
HTSN: | PARTS... |