XCZU3EG-2SFVC784I | AMD SOC - 片上系统处理器 | Avnet Asia Pacific

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XCZU3EG-2SFVC784I

FPGA Zynq UltraScale+ Family 154350 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray

XCZU3EG-2SFVC784I | SOC - 片上系统处理器 | AMD
AMD
制造商: AMD
安富利制造商模型#: XCZU3EG-2SFVC784I
RoHS 10 Compliant

The Xilinx® UltraScale™ architecture is the first ASIC-class All Programmable architecture to enable multi-hundred gigabit-per-second levels of system performance with smart processing, while efficiently routing and processing data on-chip. UltraScale architecture-based devices address a vast spectrum of high-bandwidth, high-utilization system requirements by using industry-leading technical innovations, including next-generation routing, ASIC-like clocking, 3D-on-3D ICs, multiprocessor SoC (MPSoC) technologies, and new power reduction features. The devices share many building blocks, providing scalability across process nodes and product families to leverage system-level investment across platforms.

Virtex® UltraScale+™ devices provide the highest performance and integration capabilities in a FinFET node, including both the highest serial I/O and signal processing bandwidth, as well as the highest on-chip memory density. As the industry's most capable FPGA family, the Virtex UltraScale+ devices are ideal for applications including 1+Tb/s networking and data center and fully integrated radar/early-warning systems.

Virtex UltraScale devices provide the greatest performance and integration at 20 nm, including serial I/O bandwidth and logic capacity. As the industry's only high-end FPGA at the 20 nm process node, this family is ideal for applications including 400G networking, large scale ASIC prototyping, and emulation.

Kintex® UltraScale+ devices provide the best price/performance/watt balance in a FinFET node, delivering the most cost-effective solution for high-end capabilities, including transceiver and memory interface line rates as well as 100G connectivity cores. Our newest mid-range family is ideal for both packet processing and DSP-intensive functions and is well suited for applications including wireless MIMO technology, Nx100G networking, and data center.

技术特性

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描述
输入/输出数 252
集成电路外壳/封装 FCBGA
集成电路安装 Surface Mount
最高工作温度 100
引脚数 784
最低工作温度 -40

ECCN / UNSPSC

描述
ECCN: 5A992.c
计划交货期 B: 8525601025
HTSN: 8525601050
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