AS4C8M16SA-7TCN | Alliance Memory DRAM | Avnet Asia Pacific

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AS4C8M16SA-7TCN

DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TSOP-II

AS4C8M16SA-7TCN | DRAM | Alliance Memory
Alliance Memory
制造商: Alliance Memory
产品分类: 内存, DRAM
安富利制造商模型#: AS4C8M16SA-7TCN
RoHS 6 Compliant

The 128Mb SDRAM is a high-speed CMOS synchronous DRAM containing 128 Mbits. It is internally configured as 4 Banks of 2M word x 16 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a BankActivate command which is then followed by a Read or Write command.The SDRAM provides for programmable Read or Write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The refresh functions, either Auto or Self Refresh are easy to use.By having a programmable mode register, the system can choose the most suitable modes to maximize its performance. These devices are well suited for applications requiring high memory bandwidth and particularly well suited to high performance PC applications.

技术参数

  • Fast access time from clock: 5/5.4 ns
  • Fast clock rate: 166/143 MHz
  • Fully synchronous operation
  • Internal pipelined architecture
  • 2M word x 16-bit x 4-bank
  • Programmable Mode registers
    • CAS Latency: 2, or 3
    • Burst Length: 1, 2, 4, 8, or full page
    • Burst Type: Sequential or Interleaved
    • Burst stop function
  • Operating temperature range
    • Commercial (0 ~ 70°C)
    • Industrial (-40 ~ 85°C)
  • Auto Refresh and Self Refresh
  • 4096 refresh cycles/64ms
  • CKE power down mode
  • Single +3.3V  0.3V power supply
  • Interface: LVTTL
  • 54-pin 400 mil plastic TSOP II package
  • 54-ball 8.0 x 8.0 x 1.2mm (max) FBGA package

技术特性

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描述
最低工作温度 0 °C
时钟频率最大值 143 MHz
存储器配置 8M x16
集成电路安装 Surface Mount
存储密度 128 Mbit
引脚数 54
最高工作温度 70 °C
集成电路外壳/封装 TSOP-II
额定电源电压 3.3 V

ECCN / UNSPSC

描述
ECCN: 5A992.c
计划交货期 B: 8542320040
HTSN: 8542320041
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