The CoolSiC™ MOSFET 1700 V in SMD extended creepage package is the best fit device in auxiliary power supply used in three-phase power converters. It gives the best efficiency in a simple single-ended flyback converter, and eliminates design concerns on voltage stress margin and reliability of power supply.
The new 1700V CoolSiC™ trench MOSFETS are optimized for fly-back topologies with +12V/ 0V gate-source voltage compatible with common PWM controllers, no need for a gate driver IC. The new D2PAK-7L package fulfills 1700V safety requirements with > 7mm creepage and clearance distrances, which minmizes isolation effort in the PCB design.
Features
- Optimized for fly-back topologies
- Extremely low switching loss
- 12V / 0V gate-source voltage compatible with fly-back controllers
- Fully controllable dV/dt for EMI optimization
- SMD package with enhanced creepage and clearance distances, 7 mm
Target applications
- Solar inverter
- Industrial UPS
- Industrial SMPS
- EV charger
- Motor drives
Benefits
- 1700V SiC MOSFET enables simple single-ended fly-back topology at a high efficiency level for use in auxiliary power supplies
- SMD package enables direct integration into PCB, with natural convection cooling without extra heatsink
- Reduced isolation effort due to extended creepage and clearance distances of package
- Reduced system complexity
- High power density
Diagram
