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New Products - Amphenol

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High speed OverPass solutions

Amphenol's OverPass™ portfolio delivers high-speed cable assemblies that bypass traditional PCB signal routing to create direct, low-loss interconnects between ASICs, chips, optical modules, and external I/O ports. Designed for AI, hyperscale, and next-generation data center architectures, OverPass™ solutions reduce signal loss, simplify PCB design, lower system costs, and enable scalable high-bandwidth system designs from 56G to 224G and beyond.

It delivers superior signal integrity, reduces requirements for high-grade PCBs and retimers, and simplifies motherboard design for lower system cost. Available in multiple cable configurations and high-density array connectors, it targets next-gen interconnects for AI racks, switch and compute trays, near-chip I/O and co-packaged applications.

The portfolio includes solutions optimized for pluggable I/O, near-chip connectivity, and co-packaged architectures. XtremePass™ provides a high-density copackaged copper solution for Ethernet, NVLink, PCIe®, and InfiniBand systems. XPO OverPass™ Assembly enables high-performance connectivity for 12.8 Tb/s XPO-LPO optical transceivers. SFP, QSFP, QSFP-DD, and OSFP OverPass™ solutions create direct ASIC-to-port connections that improve signal integrity while reducing PCB complexity. micro-LinkOVER™, UltraPass™, and DensiLink® extend high-speed connectivity with near-chip and on-package cable solutions that maximize density and routing flexibility for future 224G architectures.

By moving high-speed signaling off the PCB and closer to the processing device, Amphenol's OverPass™ portfolio enables architects to design scalable, lowerloss systems that support the increasing bandwidth demands of AI clusters, accelerated computing, and next-generation networking infrastructure.