Accelerating AI Data Center I/O with Transcend PCIe Gen5 SSDs
High-speed connectivity meets high-performance storage with Transcend MTE740A.
As AI data centers push higher bandwidth and faster data movement, storage must keep pace. MTE740A combines BiCS8 218-layer NAND with PCIe Gen5 x4 for fast, reliable data access.
AI data centers rely on increasingly high-speed interconnects to move massive amounts of data between compute, networking, and storage resources. As optics, NICs, and Active Electrical Cables (AECs) continue to evolve to support higher bandwidth and lower latency, the surrounding system infrastructure must also keep pace with demanding I/O requirements.
Transcend’s MTE740A M.2 SSD combines BiCS8 218-layer 3D NAND with a PCIe Gen5 x4 interface, delivering sequential read speeds of up to 14,000 MB/s and write speeds of up to 13,000 MB/s. With capacities up to 4TB, it provides high-speed and reliable storage for data-intensive computing environments.
Built for demanding industrial applications, the MTE740A incorporates Corner Bond technology, a 30µ" PCB gold finger, anti-sulfur technology, and Power Shield to enhance durability and data integrity. The MTE740A-I wide-temperature version supports operation from -40°C to 75°C for systems deployed in more challenging environments.
Features
- BiCS8 218-layer 3D NAND for enhanced storage density
- PCIe Gen5 x4 interface for high-speed data access
- Sequential read/write speeds up to 14,000/13,000 MB/s
- Up to 2,100,000 IOPS random read performance
- 1TB, 2TB, and 4TB capacities
- 3K P/E cycles for enhanced endurance
- Corner Bond and 30µ" PCB gold finger for durability
- TCG Opal 2.0 and AES-256 hardware-based encryption
- Power Shield for improved data integrity during power interruption
- Wide-temperature MTE740A-I supports -40°C to 75°C
Applications
- AI data center computing platforms
- High-performance servers and storage systems
- AI and data-intensive computing workloads
- High-speed networking infrastructure
- Edge AI and industrial computing systems
- Systems requiring fast local data access and reliable storage
Key components
- BiCS8 218-layer 3D NAND flash
- PCIe Gen5 x4 / NVMe 2.0 interface
- M.2 2280 form factor
- Corner Bond technology
- 30µ" PCB gold finger
- Power Shield technology
- TCG Opal 2.0 and AES-256 hardware encryption
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Secure Erase
- ASPM (Active-State Power Management) power management mechanism
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
Benefits
- Accelerates local data access for demanding AI workloads
- Helps storage keep pace with high-speed system I/O
- Supports high-bandwidth computing platforms with PCIe Gen5 performance
- Enhances system reliability in demanding industrial environments
- Provides data protection for sensitive workloads
- Offers wide-temperature operation for challenging deployment conditions
