Enabling 800G AI Fabrics with OSFP Connectivity
Molex OSFP Connector Systems support up to 224Gbps PAM-4 per lane and aggregate data rates up to 1.6Tbps. Single- and dual-port, 8- and 16-lane options help address AI data center capacity needs while minimizing space impact.
As AI data centers scale to support higher bandwidth and 800G networking, interconnects must provide reliable signal integrity, effective thermal management and design flexibility. Molex OSFP Connector Systems support up to 224Gbps PAM-4 per lane and accommodate optical, AEC, DAC and ACC solutions. High-density configurations, enhanced EMI shielding and air- or liquid-cooling options help address the evolving requirements of AI infrastructure while streamlining upgrades from previous-generation 56 and 112Gbps designs.
Features
- Up to 224Gbps PAM-4 per lane for 400G, 800G, and 1.6T networking
- Optimized for AI, HPC, and hyperscale data center applications
- Supports optical, AEC, DAC, and ACC connectivity options
- High-density design for scalable AI infrastructure
- Superior thermal performance and airflow management
- Robust EMI protection for reliable signal integrity
- Backward compatibility enables seamless technology upgrades
Applications
Networking
- Cloud infrastructure
- Edge-computing infrastructure
- Enterprise infrastructure
Server and Storage
- 224G, 112G and 56G applications
- AI and machine-learning systems
- High-performance computing systems
- Hyperscale data centers
- Open Compute Project applications
- PCIe systems
Key components
- OSFP connector system
- EMI shielding cages
- High-speed cable assemblies
- Single- and dual-port configurations
Benefits
- Supports 400G, 800G and 1.6T AI networking
- Accommodates optical, AEC, DAC and ACC solutions
- Optimizes port density for AI data centers
- Enhances thermal management and airflow
- Improves signal integrity through robust EMI shielding
- Streamlines upgrades through compatibility with previous-generation 56 and 112Gbps designs
