ELSFP
Reliable optical power delivery for CPO / High-density, compact pluggable design / Compatible with PM and single-mode fiber / Designed to minimize high-speed PCB signal-path losses / Supports up to two 12-fiber MT interfaces.
Amphenol ELSFP (External Laser Small Form Factor Pluggable) interconnect solutions provide reliable optical power delivery from external laser sources to co-packaged optics (CPO) engines. The compact, serviceable interface supports PM and single-mode fiber with up to two 12-fiber MT ferrules. Designed for high-density AI, data center, and networking systems, the ELSFP architecture supports OIF-compliant connectivity and up to 100 connector/ cage mating cycles for scalable, field-serviceable optical systems.
OIF-defined ELSFP interface architecture / Up to two 12-fiber MT ferrules per interface / Up to 12 optical fibers per MT ferrule / PM and single-mode fiber configurations / Precision rotational alignment for PM fibers / Front- or rear-panel optical connectivity / Blind-mate pluggable optical interface / Defined electrical, thermal and mechanical interface
Features
- Operating Voltage: 30 V DC per contact
- Operating Current: 0.5 A per signal contact max., 1.5 Aper power contact max.
- Differential Impedance: 95 Ω ± 10
- Contact Area: 0.76 μm Gold
- Press-fit Pins: Matte Tin
- Plating: Both over Nickel underplate
- Operating Temperature Range: -40 °C to +85 °C
- Designed for external-laser / CPO front-panel use
- Durability: 100 mating cycles
- Connector pitch: 0.75 mm
- Cage options: 1X1 ,1x4, 1x6 and 1x8(100mm and 116mm both)
- Product Compliance: OIF-ELSFP-02.0
- Connector Housing Flammability: UL 94 V-0
Applications
Computer Tray , Networking Switch , Switch Tray
Key components
- Connector contacts: Copper Alloy
- Connector Housing: LCP
- Cages: Stainless Steel
- Press-fit host connector interface
Benefits
- Enables efficient optical power delivery to CPO engines
- Increases density within space-constrained systems
- Simplifies field replacement and system maintenance
- Reduces high-speed electrical PCB trace losses
- Improves polarization control through precise alignment
- Enhances interoperability through OIF-defined interfaces
- Facilitates scalable next-generation network architectures
- Supports reliable blind-mate installation and servicing
