SS1FH6HM3/H
- Low profile package
- Ideal for automated placement
- Low forward voltage drop, low power losses
- Low leakage current
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Wave and reflow solderable
Technical Attributes
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| Description | Value | |
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| 1 A | ||
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| Surface Mount | ||
| 40 A | ||
| 700 mV | ||
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| 175 °C | ||
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| 60 V |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | null |
| ECCN: | EAR99 |
| HTSN: | 85411000 |
| Schedule B: | 85411000 |
Factory Lead Time: