SFH 2401
Technical Attributes
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| Description | Value | |
|---|---|---|
| Tin | ||
| Clear Epoxy | ||
| 260 °C | ||
| 25 nA | ||
| 0.04 us | ||
| 0.04 us | ||
| Surface Mount | ||
| MSL 4 - 72 hours | ||
| 2.2, 5.5 V | ||
| -40 to 85 °C | ||
| 2DIL SMD | ||
| 0.66 A/W | ||
| Si | ||
| 2 | ||
| 4.4 x 3.9 x 1.15 mm | ||
| 16 V | ||
| DIL SMD | ||
| Chip | ||
| 950 nm |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | null |
| ECCN: | EAR99 |
| HTSN: | null |
| Schedule B: | null |