XC7Z007S-1CLG400I | AMD SOC - 片上系統處理器 | Avnet Asia Pacific

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XC7Z007S-1CLG400I

PSoC / MPSoC Microprocessor, Zynq-7000 Family, ARM Cortex-A9, 667 MHz, BGA-400, NCNR

XC7Z007S-1CLG400I | SOC - 片上系統處理器 | AMD
AMD
製造商: AMD
替代料號: XC7Z007S-1CLG400I
RoHS 10 Compliant

The Xilinx Zynq®-7000 All Programmable SoC (AP SoC) family integrates software programmability of an ARM® based processor with hardware programmability of FPGA enabling key analytics and hardware acceleration while integrating CPU, DSP, ASSP and mixed signal functionality on a single device. Available in single-core Zynq®-7000S and dual-core Zynq®-7000 devices. Zynq®-7000S devices feature single core ARM® Cortex™-A9 processor mated with 28nm Artix®-7 based programmable logic representing lowest cost entry point to the scalable Zynq®-7000 platform. Ideal for industrial IoT applications such as motor control and embedded vision. Zynq®-7000 devices are equipped with dual-core ARM® Cortex™-A9 processors integrated with 28nm Artix®-7 or Kintex®-7 based programmable logic (up to 6.6M logic cells of logic and 12.5Gb/s transceivers) for excellent performance-per-watt, maximum design flexibility and to enable highly differentiated designs for wide range of embedded applications.

技術參數

  • Available in -3, -2, -2L, -1, -1L speed grades and commercial/ industrial/ extended temperature
  • 2.5DMIPS/MHz per CPU, 1GHz CPU frequency, ARMv7-A and Jazelle RCT execution environment architecture
  • NEONâ„¢ media processing engine, vector floating point unit, CoreSightâ„¢ and program trace macrocell
  • 32KB instruction, 32KB data per processor L1 cache, 512KB L2 cache, 256KB on-chip memory
  • DDR3, DDR3L, DDR2, LPDDR2 external memory support and 2 x quad-SPI, NAND, NOR static memory support
  • 8-channel DMA controller, 2 x UART, 2 x CAN 2.0B, 2 x I2C, 2 x SPI, 4 x 32b GPIO peripherals
  • 2 x USB 2.0 (OTG), 2 x tri-mode gigabit Ethernet, 2 x SD/SDIO key peripherals
  • RSA authentication, AES and SHA 256bit decryption and authentication for secure boot
  • Zynq®-7000 AP SoC provides smarter, optimized and most secure solution
  • Unmatched integration, performance and power, proven productivity

技術屬性

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描述
集成電路貼裝 Surface Mount
邏輯單元數量 23000
引腳數 400
最高工作溫度 100
集成電路外殼/封裝 WCBGA
最低工作溫度 -40
用戶輸入/輸出數量 100
速度等級 1

ECCN/UNSPSC

描述
ECCN: EAR99
計劃交貨期 B: 8542310000
HTSN: 8542310001
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