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The CoolRunner XPLA3 (eXtended Programmable Logic Array) family of CPLDs is targeted for low power systems that include portable, handheld, and power sensitive applications. Each member of the CoolRunner XPLA3 family includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the CoolRunner XPLA3 family offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for "turbo bits" or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. CoolRunner devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.
The CoolRunner XPLA3 family employs a full PLA structure for logic allocation within a function block. The PLA provides maximum flexibility and logic density, with superior pin locking capability, while maintaining deterministic timing.
CoolRunner XPLA3 CPLDs are supported by Xilinx® WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.
The CoolRunner XPLA3 family features also include the industry-standard, IEEE 1149.1, JTAG interface through which boundary-scan testing, In-System Programming (ISP), and reprogramming of the device can occur. The CoolRunner XPLA3 CPLD is electrically reprogrammable using industry standard device programmers.
技術參數
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描述 | 值 |
---|---|---|
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速度等級 | 10 |
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集成電路貼裝 | Surface Mount |
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引腳數 | 144 |
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用戶輸入/輸出數量 | 108 |
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最高工作溫度 | 70 |
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集成電路外殼/封裝 | TQFP |
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宏單元數量 | 128 |
描述 | 值 |
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ECCN: | EAR99 |
計劃交貨期 B: | PARTS... |
HTSN: | PARTS... |