Samtec offers a high-density interconnect system that meets the COM-HPC® standard for high-performance CoMs. COM-HPC meets the growing demands for server-grade performance at the edge providing extended connectivity and limitless scalability.
COM-HPC® provides system and interface flexibility by adopting a pair of 400 pin connectors (800 pins total) based on Samtec's AcceleRate® HP High-Performance Arrays. Samtec COM-HPC®-aligned connectors support existing and future interfaces such as PCIe® 5.0 (32 Gbps) and up to 100 Gb Ethernet.
The female Module Receptables are employed at a standard height. The male Carrier Plugs vary to allow for either a 5 mm or 10 mm stack height.
Depending on the application, the connector pinouts are optimized for Client or Server module as defined in the COM-HPC® specification.
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