Hero Banner

New Products - Samtec

NPI Body

AcceleRate® HP High-Performance Arrays

Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.

 

Features

  • Flexible open-pin-field and cost optimized,  extreme performance solution
  • 5 mm and 10 mm stack heights; right-angle socket available (APF6-RA)
  • Four row design with up to 400 total pins on a 0.635 mm pitch; roadmap to 1,000+ pins
  • Solder column termination for improved SI and ease of processing
  • Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE
  • Additional row and pin counts in development
  • SureWare™ guide post standoffs (GPSO) available
  • Analog Over Array™ capable (see page 29)

 

Application 

  • Energy
  • Servers
  • Quantum Computing
  • Semiconductor Manufacturing
  • Automotive & Transportation
  • Computer
  • Mecical
  • Datacom
  • AI
  • Industrial/IIoT

 

Body Content Spots

Supplier Logo

Content Spots

Newsletter

Subscribe for Online Delivery

SIGNUP