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Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems

The rapid advancement of AI is placing immense demands on underlying cluster communication networks, particularly regarding speed, port density, and energy efficiency. To overcome these connectivity bottlenecks, Samtec has leveraged deep expertise in the CPX field to launch an innovative co-packaged interconnect solution. Supporting both Co-Packaged Copper (CPC) and Co-Packaged Optics (CPO) interfaces, this solution provides robust support for the scaling and expansion of AI systems.

Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector. The SFCM mounts directly to the package substrate and is pluggable with Samtec's SFCC cable assembly or an optical cable assembly of your choosing (contact HDR@samtec.com for more details).

Features

High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCM, SFCC, Optics)
Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)
PCIe® 7.0 capable
Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew
Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications
High-density mezzanine arrays feature 64 differential pairs per square inch
Routes an extremely high number of transmission lines from one PCB to the next
Surface mount reflow technology to the PCB
Contact HDR@samtec.com for more information