Are you looking to elevate the audio capabilities of your consumer electronics? Look no further. Infineon's XENSIV™ MEMS microphones are the gold standard for capturing audio signals with unparalleled precision and quality. The microphones are comprised of Infineon’s MEMS microphone chips and ASICs which are not without reason the world’s best-selling microphone components.
Infineon's XENSIV™ MEMS microphones boast an impressive array of features that set them apart from the competition. Featuring ultra-low self-noise (high SNR), extremely low distortions (THD) even at high sound pressure levels (SPL), very tight part-to-part phase and sensitivity matching, a flat frequency response with a low LFRO (low frequency roll-off) and an ultra-low group delay. Combined with selectable power modes and their very small package size, Infineon XENSIV™ MEMS microphones are a perfect match for consumer applications (earbuds, headphones, wearables, smart speakers, laptops, tablets, etc.) with excellent audio capturing functionalities and also for industrial and medical applications (predictive and preventive maintenance, security, patient monitoring systems, etc.).
Target Applications:
- TWS earbuds
- ANC headphones
- Smart speakers
- Conference Speakers
- Laptops / Tablets
- Wearables
- AR/VR devices
- Healthcare
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IM66D130M: Ultra-low power digital XENSIV™ MEMS microphone
Strong acoustic performance with small footprint and low current consumption
Clear audio signals even for high sound pressure levels
Performance across wide frequency range for audio beams and algorithms
Key features:
- Low 510 µA current consumption in always-on mode
- Component level IP57 water and dust resistant
- 66 dB(A) Signal-to-noise ratio
- Acoustic overload point (AOP) of 130 dBSPL
- Tight sensitivity (-37/-37 ± 1 dB) tolerances
- 35 Hz low frequency roll-of
Target applications:
- Active Noise Cancellation (ANC): headphones and earphones
- Smartphones and mobile devices
- Hearing enhancement devices
- Voice User Interface (VUI): e.g. smart speaker, home automation, and IOT devices
- Power constrained applications
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IM68D128B: Low power digital PDM XENSIV™ MEMS microphone
Battery saving without compromising in acoustic performance
Clear audio signals even for high sound pressure levels
Highest precision of audio beams and algorithms
Key features:
- Low 580 µA current consumption in always on mode
- Component level IP57 water and dust resistant
- 67.5 dB(A) Signal-to-noise ratio
- Acoustic overload point (AOP) of 128 dBSPL
- Tight sensitivity (-37 ± 1 dB) tolerance
- 20 Hz low frequency roll-of
Target applications:
- Active Noise Cancellation (ANC): headphones and earphones
- Smartphones and mobile devices
- Hearing enhancement devices
- Voice User Interface (VUI): e.g. smart speaker, home automation, and IOT devices
- Power constrained applications
Download IM68D128B Product Brief | Download Microphones Flex Kit Product Brief | Download Datasheet | Download PQR
IM72D128V: Ultra-low power digital XENSIV™ MEMS microphone
Strong acoustic performance with small footprint and low current consumption
Clear audio signals even for high sound pressure levels
Performance across wide frequency range for audio beams and algorithms
Key features:
- Signal-to-noise ratio of 71.5dB(A) SNR
- Acoustic overload point at 128dBSPL
- IP57 dust and water resistant
- Digital PDM interface
- Flat frequency response: LFRO at 11Hz
- Narrow sensitivity and phase tolerances
- Omnidirectional pickup pattern
- SMD Package: 4mm x 3mm x 1.2mm
Target applications:
- Active Noise Cancellation (ANC) headphones and earbuds
- Laptops and tablets
- Cameras, camcorders, and camera accessories
- Smart speakers
- IoT devices
IM72D128: Ultra-high performance XENSIV™ MEMS microphone with very high dynamic range
Crystal clear audio pick up of the quietest and the loudest sounds
High ingress protection (IP57) at a microphone level
Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)
Key features:
- Ultra-low self-noise / ultra-high SNR (72dB)
- Selectable power modes for battery critical applications (980/280µA)
- Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
- Ultra-high dynamic range and high acoustic overload point (AOP) of 128dBSPL
- Very tight part-to-part phase and sensitivity matching (± 1dB)
- Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
- Very low group delay (7µs @ 1kHz)
Target applications:
- ANC Headphones
- Conference systems
- Smart speaker
- Laptops & tablets
- Surveillance
- Cameras
Download Product Brief | Download Application note | Download Datasheet | Download PQR
IM70A135: High performance analog XENSIV™ MEMS microphone
Powerful far-field and low volume audio pick-up
Crystal clear audio signals even in compact package size
Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)
Key features:
- Very High 70dB(A) Signal-to-noise ratio
- Ultra-low power modes for battery critical applications (170/70µA)
- Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
- Ultra-high acoustic overload point (AOP) of 135dBSPL
- Very tight part-to-part phase and sensitivity matching (± 1dB)
- Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz
Target applications:
- True wireless earbuds
- Active Noise Cancelling headphones
- Smart speakers
- Home automation and IoT devices
- Cameras
- Conference systems
Download Product Brief | Download Datasheet | Download PQR