CRCW0402140RFKED
- Stability ?R/R = 1 % for 1000 h at 70 ° C
- 2 mm pitch packaging option for 0603 size
- Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes
- Metal glaze on high quality ceramic
Technical Attributes
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ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | null |
| ECCN: | EAR99 |
| HTSN: | 85332100 |
| Schedule B: | 85332100 |
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