223956-1

The emergence of high speed serial backplnes has forced interconnections to be able to transfer data at gigabit speeds.

The Z-PACK HS3 connector system has been specifically designed to support this generation of high speed serial data transfer has incorporated a controlled impedance microstrip path through the connector to minimize signal degradation and crosstalk. Compliant pins are used on both daughter card and backplane.

This connector family is press fit and is compatible with other Z-PACK HM family connectors on the same board edge. Z-PACK HS3 connectors support data rates of 6.2+ Gb/s per differential pair. The 6 row version is optimized for 20.32mm or 0.8 inch card centerline applications. while the 10 row version is optimized for high density for 25.4mm or 1.0 inch card centerline applications.

The Universal Power Module (UPM) is designed to be compatible with the Z-PACK HS3 connector.

Static Discharge Guide/Power Pins, Guide Pin/Power Receptacles, Universal Guide Pin and Receptacles, and Coding Keys (10 row only) are also available.

• High speed, high density two piece board-to-board backplane connector
• Dual beam provides redundant contact for improved reliability
• For data rates of 6.2+ Gb/s
• 10 row, 100 high speed lines per 25,00 [.984]
• 6 row, 60 high speed lines per 25,00 [.984]
• Controlled impedance: 50 ohm Single Ended 100 ohm Differential
• Feedthrough versions for midplane applications
• 250 mating cycles
• End stackable on 2.50 [.0981 centerline, signal pin to signal pin
• Advanced ESD/Power (10 Amps) using optional guide pins and power contacts