L-05B2N2SV6T
Ind RF Chip Molded Multi-Layer 2.2nH 0.3nH 100MHz 4Q-Factor Ceramic 300mA 0201 Paper T/R
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Manufacturer:Johanson Technology
Avnet Manufacturer Part #: L-05B2N2SV6T
Secondary Manufacturer Part#: L-05B2N2SV6T
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RoHS 10 Compliant -
Tariff Charges
High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin plated nickel barrier terminations and tape and reel packaging which makes them ideal for small size/high volume wireless applications.
- CELL/PCS Modules
- Wireless LAN
- Broadband Components
- RFID
- RF Transceivers
- RoHS Compliant (Standard, “V” Code)
- Sn/Pb Terminations Optional (“T” Code)
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| Ceramic | ||
| 300 | ||
| 2.2 nH | ||
| 0.3 | ||
| 201 | ||
| 0.3 mm | ||
| 0.6 mm | ||
| 0.3 | ||
| 9.94 |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | null |
| ECCN: | EAR99 |
| HTSN: | PARTS... |
| Schedule B: | PARTS... |
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