374024B00035G
Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm
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Manufacturer:Boyd
Product Category:
Thermal Management, Heat Sinks
Avnet Manufacturer Part #: 374024B00035G
Secondary Manufacturer Part#: 374024B00035G
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RoHS 10 Compliant -
Tariff Charges
The 374024B00035G is a 10 x 23 x 23mm pin fin Heat Sink with tape attachment. This heat sink is made of aluminium and due its tape mounting it saves board space by eliminating mounting holes, convenient peel and stick assembly is quick and clean. The pin fin array allows omnidirectional airflow to maximize heat dissipation.
Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| Adhesive Tape | ||
| 23 x 23 x 10 mm | ||
| 40 °C/W |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | null |
| ECCN: | EAR99 |
| HTSN: | PARTS... |
| Schedule B: | PARTS... |
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