ASFC32G31T3-51BIN

ASFC32G31T3-51BIN e·MMC is a managed non-volatile storage consisting of a single chip MMC controller and a NAND flash memory chip inside a JEDEC defined standard BGA package. It is specially designed as a small form factor memory product for storage of data and as a boot media. The performance is optimized to a mostly read operation mode at low power consumption. The utilization of 3D TLC NAND technology, with the option to configure the memory in enhanced mode (pSLC), targets higher demanding industrial, which is supported by the industrial temperature grade specification. The e·MMC controller directly manages NAND flash, including ECC, wear-levelling, IOPS optimization and read sensing. The firmware features support high throughput for large data transfers and performance for small random data more commonly found in code usage. It also contains several security features as well as multiple boot partitions.

• 32Gb capacity, 5.1 eMMC version, 256Gb x 1 NAND die
• Multiple 3D TLC or enhanced/reliable mode partitions user configurable according to e·MMC Spec 5.1
• Power-fail data loss protection, wear levelling technology
• Field firmware update according to e·MMC Spec 5.1
• Boot operation mode and alternative boot operation mode
• Replay protected memory block (RPMB), VCC voltage range from 2.7V to 3.6V
• VCCQ voltage range from 1.7V to 1.95V or 2.7V to 3.6V
• Read current is 141mA typ at (VCCQ 1.8V), write current is 89mA typ at (VCCQ 1.8V
• Sleep current is 0.06mA typ at (VCCQ 1.8V), 3D TLC NAND base technology
• Industrial temperature range from -40°C to 85°C, 153-ball FBGA package