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AS4C16M16SA-6BINTR

DRAM Chip SDRAM 256M-Bit 16M X 16 3.3V 54-Pin TFBGA T/R

Manufacturer:Alliance Memory
Product Category: 記憶體, DRAM
Avnet Manufacturer Part #: AS4C16M16SA-6BINTR
Secondary Manufacturer Part#: AS4C16M16SA-6BINTR
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The 256Mb SDRAM is a high-speed CMOS synchronous DRAM containing 256 Mbits. It is internally configured as 4 Banks of 4M word x 16 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a BankActivate command which is then followed by a Read or Write command.The SDRAM provides for programmable Read or Write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The refresh functions, either Auto or Self Refresh are easy to use.By having a programmable mode register, the system can choose the most suitable modes to maximize its performance. These devices are well suited for applications requiring high memory bandwidth and particularly well suited to high performance PC applications.

  • Fast access time from clock: 5/5.4 ns
  • Fast clock rate: 166/143 MHz
  • Fully synchronous operation
  • Internal pipelined architecture
  • 4M word x 16-bit x 4-bank
  • Programmable Mode registers
    • CAS Latency: 2 or 3
    • Burst Length: 1, 2, 4, 8, or full page
    • Burst Type: Sequential or Interleaved
    • Burst stop function
  • Operating temperature range
    • Commercial (0 ~ 70°C)
    • Industrial (-40 ~ 85°C)
  • Auto Refresh and Self Refresh
  • 8192 refresh cycles/64ms
  • CKE power down mode
  • Single +3.3V ±0.3V power supply
  • Interface: LVTTL
  • 54-pin 400 mil plastic TSOP II package
  • 54-ball 8.0 x 8.0 x 1.2mm (max) FBGA package

Technical Attributes

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Description Value
13 Bit
166 MHz
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260 °C
166 MHz
60 mA
5|6 ns
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54
4
16 Bit
16 Bit
3.3 V
-40 to 85 °C
85 °C
-40 °C
16M x 16
54TFBGA
54
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Industrial
TFBGA
3.3 V
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ECCN / UNSPSC / COO

Description Value
Country of Origin: null
ECCN: EAR99
HTSN: 8542330001
Schedule B: 8542330000
In Stock :  0
Additional inventory
Factory Lead Time: 56 Weeks
Price for: Each
Quantity:
Min:2500  Mult:2500  
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