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AS4C128M16D2A-25BIN

DRAM Chip DDR2 SDRAM 2Gb 128M x 16 1.8V 84-Pin TFBGA

Official logo for Alliance Memory
Manufacturer:Alliance Memory
Product Category: 内存, DRAM
Avnet Manufacturer Part #: AS4C128M16D2A-25BIN
Secondary Manufacturer Part#: AS4C128M16D2A-25BIN
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The 2Gb DDR2 is a high-speed CMOS Double-DataRate-Two (DDR2), synchronous dynamic random - access memory (SDRAM) containing 2048 Mbits in a 16- bit wide data I/Os. It is internally configured as a 8-bank DRAM, 8 banks x 16Mb addresses x 16 I/Os. The device is designed to comply with DDR2 DRAM key features such as posted CAS# with additive latency, Write latency = Read latency -1, Off-Chip Driver (OCD) impedance adjustment, and On Die Termination(ODT).All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in RAS #, CAS# multiplexing style. Accesses begin with the registration of a Bank Activate command, and then it is followed by a Read or Write command. Read and write accesses to the DDR2 SDRAM are 4 or 8-bit burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Operating the eight memory banks in an interleaved fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. A sequential and gapless data rate is possible depending on burst length, CAS latency, and speed grade of the device.

  • JEDEC Standard Compliant
  • JEDEC standard 1.8V I/O (SSTL_18 compatible)
  • Power supplies: VDD & VDDQ +1.8V ± 0.1V
  • Operating temperature:
    • Commercial (0 ~ 85 °C)
    • Industrial (-40 ~ 95 °C)
  • Supports JEDEC clock jitter specification
  • Fully synchronous operation
  • Fast clock rate: 400MHz
  • Differential Clock, CK & CK#
  • Bidirectional single/differential data strobe
    • DQS & DQS#
  • 8 internal banks for concurrent operation
  • 4-bit prefetch architecture
  • Internal pipeline architecture
  • Precharge & active power down
  • Programmable Mode & Extended Mode registers
  • Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5
  • WRITE latency = READ latency - 1 tCK
  • Burst lengths: 4 or 8
  • Burst type: Sequential / Interleave
  • DLL enable/disable
  • Off-Chip Driver (OCD) - Impedance Adjustment - Adjustable data-output drive strength

Technical Attributes

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Description Value
14 Bit
400 MHz
16 Bit
2 Gbit
DDR2 SDRAM
Tin-Silver-Copper
400 MHz
150 mA
0.4 ns
2 Gbit
Surface Mount
MSL 3 - 168 hours
84
8
16 Bit
16 Bit
1.8000 V
-40 to 95 °C
95 °C
-40 °C
128M x 16
84TFBGA
84
12.5 x 8 x 0.8 mm
Industrial
TFBGA
1.8 V
DDR2 SDRAM

ECCN / UNSPSC / COO

Description Value
Country of Origin: null
ECCN: EAR99
HTSN: 8542330001
Schedule B: 8542330000
In Stock :  0
Additional inventory
Factory Lead Time: 84 Weeks
Price for: Each
Quantity:
Min:209  Mult:209  
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