AS4C128M16D2A-25BIN
DRAM Chip DDR2 SDRAM 2Gb 128M x 16 1.8V 84-Pin TFBGA
- RoHS 10 Compliant
- Tariff Charges
The 2Gb DDR2 is a high-speed CMOS Double-DataRate-Two (DDR2), synchronous dynamic random - access memory (SDRAM) containing 2048 Mbits in a 16- bit wide data I/Os. It is internally configured as a 8-bank DRAM, 8 banks x 16Mb addresses x 16 I/Os. The device is designed to comply with DDR2 DRAM key features such as posted CAS# with additive latency, Write latency = Read latency -1, Off-Chip Driver (OCD) impedance adjustment, and On Die Termination(ODT).All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in RAS #, CAS# multiplexing style. Accesses begin with the registration of a Bank Activate command, and then it is followed by a Read or Write command. Read and write accesses to the DDR2 SDRAM are 4 or 8-bit burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Operating the eight memory banks in an interleaved fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. A sequential and gapless data rate is possible depending on burst length, CAS latency, and speed grade of the device.
- JEDEC Standard Compliant
- JEDEC standard 1.8V I/O (SSTL_18 compatible)
- Power supplies: VDD & VDDQ +1.8V ± 0.1V
- Operating temperature:
- Commercial (0 ~ 85 °C)
- Industrial (-40 ~ 95 °C)
- Supports JEDEC clock jitter specification
- Fully synchronous operation
- Fast clock rate: 400MHz
- Differential Clock, CK & CK#
- Bidirectional single/differential data strobe
- DQS & DQS#
- 8 internal banks for concurrent operation
- 4-bit prefetch architecture
- Internal pipeline architecture
- Precharge & active power down
- Programmable Mode & Extended Mode registers
- Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5
- WRITE latency = READ latency - 1 tCK
- Burst lengths: 4 or 8
- Burst type: Sequential / Interleave
- DLL enable/disable
- Off-Chip Driver (OCD) - Impedance Adjustment - Adjustable data-output drive strength
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| 14 Bit | ||
| 400 MHz | ||
| 16 Bit | ||
| 2 Gbit | ||
| DDR2 SDRAM | ||
| Tin-Silver-Copper | ||
| 400 MHz | ||
| 150 mA | ||
| 0.4 ns | ||
| 2 Gbit | ||
| Surface Mount | ||
| MSL 3 - 168 hours | ||
| 84 | ||
| 8 | ||
| 16 Bit | ||
| 16 Bit | ||
| 1.8000 V | ||
| -40 to 95 °C | ||
| 95 °C | ||
| -40 °C | ||
| 128M x 16 | ||
| 84TFBGA | ||
| 84 | ||
| 12.5 x 8 x 0.8 mm | ||
| Industrial | ||
| TFBGA | ||
| 1.8 V | ||
| DDR2 SDRAM |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | null |
| ECCN: | EAR99 |
| HTSN: | 8542330001 |
| Schedule B: | 8542330000 |