74AUP1T97GN,132 | Nexperia 转换器/电平转换器 | Avnet Asia Pacific

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74AUP1T97GN,132

Voltage Level Translator 6-Pin XSON

74AUP1T97GN,132 | 转换器/电平转换器 | Nexperia
Nexperia
制造商: Nexperia
安富利制造商模型#: 74AUP1T97GN,132
RoHS 10 Compliant

The 74AUP1T97 provides low-power, low-voltage configurable logic gate functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter and buffer. All inputs can be connected to VCC or GND. plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm This device ensures a very low static and dynamic power consumption across the entire VCC range from 2.3 V to 3.6 V. The 74AUP1T97 is designed for logic-level translation applications with input switching levels that accept 1.8 V low-voltage CMOS signals, while operating from either a single 2.5 V or 3.3 V supply voltage. The wide supply voltage range ensures normal operation as battery voltage drops from 3.6 V to 2.3 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. Schmitt trigger inputs make the circuit tolerant to slower input rise and fall times across the entire VCC range.

技术参数

  • Wide supply voltage range from 2.3 V to 3.6 V
  • High noise immunity
  • ESD protection:
    • HBM JESD22-A114F Class 3A exceeds 5000 V
    • MM JESD22-A115-A exceeds 200 V
    • CDM JESD22-C101E exceeds 1000 V
  • Low static power consumption; ICC = 1.5 µA (maximum)
  • Latch-up performance exceeds 100 mA per JESD 78 Class II
  • Inputs accept voltages up to 3.6 V
  • Low noise overshoot and undershoot < 10 % of VCC
  • IOFF circuitry provides partial power-down mode operation
  • Multiple package options
  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

技术特性

查找类似的料号
描述
输出电流 4 mA
引脚数 6
逻辑 IC 系列 AUP
传播时延 8.4 ns
集成电路外壳/封装 XSON

ECCN / UNSPSC

描述
ECCN: EAR99
计划交货期 B: 8542390000
HTSN: 8542390001

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标题 下载 类别 发布日期
Improved BOM of leadless 5/6 pad packages, including die optimization to achieve zero delamination in ATSN (Nexperia Assembly & Test Plant Seremban Malaysia) PCN-Documentation 20191231
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