XCKU095-1FFVA1156C by AMD FPGAs | Avnet Asia Pacific

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XCKU095-1FFVA1156C

FPGA Kintex UltraScale Family 1176000 Cells 20nm Technology 0.95V 1156-Pin FC-BGA Tray

XCKU095-1FFVA1156C in FPGAs by AMD
AMD
Manufacturer: AMD
Product Category: Programmable Logic, FPGAs
Avnet Manufacturer Part #: XCKU095-1FFVA1156C
RoHS 6 Compliant

Xilinx® Ultra Scale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.

Kintex® Ultra Scale FPGAs: High-performance FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.

Kintex Ultra Scale+ FPGAs: Based on the Ultra Scale architecture, these devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex Ultra Scale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.

Virtex® Ultra Scale FPGAs: The industry's most capable high-performance FPGAs enabled using both monolithic and next-generation SSI technology to achieve the highest system capacity, bandwidth, and performance. Variants of the Virtex Ultra Scale family are optimized to address key market and application requirements through integration of various system-level functions, delivering unprecedented embedded memory and serial connectivity capabilities.

Virtex Ultra Scale+ FPGAs: Based on the Ultra Scale architecture, these devices have the highest transceiver bandwidth, highest DSP count, and highest on-chip memory available in the industry for the ultimate in system performance. In addition, Virtex Ultra Scale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.

Key Features

  • Processing System
  • I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken
  • Clocks and Memory Interfaces
  • Routing, SSI, Logic, Storage, and Signal Processing
  • Configuration, Encryption, and System Monitoring

Technical Attributes

Find Similar Parts
Description Value
Operating Temperature Max 85
Speed Grade 1
No. of User I/Os 520
No. of Pins 1156
No. of Logic Cells 1
IC Case / Package FCBGA
IC Mounting Surface Mount

ECCN / UNSPSC / COO

Description Value
ECCN: 3A991.d
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