XC7S6-1FTGB196I by AMD FPGAs | Avnet Asia Pacific

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XC7S6-1FTGB196I

FPGA, Spartan7 XC7S6 Series, 938 Blocks, 6000 Macrocells, 180Kbit RAM, 0.95-1.05V, CSBGA-196, NCNR

XC7S6-1FTGB196I in FPGAs by AMD
AMD
Manufacturer: AMD
Product Category: Programmable Logic, FPGAs
Avnet Manufacturer Part #: XC7S6-1FTGB196I
Datasheet
XC7S6-1FTGB196I
RoHS 10 Compliant

Xilinx 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:
  • Spartan-7 Family: Optimized for low cost, lowest power, and high I/O performance. Available in low-cost, very small form-factor packaging for smallest PCB footprint
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

Key Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory
  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering
  • High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s
  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces
  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors
  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering
  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter
  • Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs
  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction
  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option
  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power

Technical Attributes

Find Similar Parts
Description Value
No. of Logic Cells 6
Operating Temperature Max 100
No. of User I/Os 100
IC Mounting Surface Mount
No. of Pins 196
IC Case / Package CSBGA
Operating Temperature Min -40
Speed Grade 1

ECCN / UNSPSC / COO

Description Value
ECCN: EAR99
SCHEDULE B: 8525601025
HTSN: 8525601050
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