XC7S25-1CSGA324C by AMD FPGAs | Avnet Asia Pacific

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XC7S25-1CSGA324C

FPGA, Spartan-7, 3650 Blocks, 23360 Macrocells, 1620Kbit, 0.95-1.05V Core Supply, CSBGA-324, NCNR

XC7S25-1CSGA324C in FPGAs by AMD
AMD
Manufacturer: AMD
Product Category: Programmable Logic, FPGAs
Avnet Manufacturer Part #: XC7S25-1CSGA324C
RoHS 10 Compliant

Xilinx 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.
The 7 series FPGAs include:
  • Spartan-7 Family: Optimized for low cost, lowest power, and high I/O performance. Available in low-cost, very small form-factor packaging for smallest PCB footprint.
  • Artix-7 Family: Optimized for low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications.
  • Kintex-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
  • Virtex-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

Key Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data
    buffering.
  • High-performance SelectIO technology with support for DDR3
    interfaces up to 1,866 Mb/s.
  • High-speed serial connectivity with built-in multi-gigabit transceivers
    from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s,
    offering a special low-power mode, optimized for chip-to-chip
    interfaces.
  • A user configurable analog interface (XADC), incorporating dual
    12-bit 1MSPS analog-to-digital converters with on-chip thermal and
    supply sensors.
  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder
    for high-performance filtering, including optimized symmetric
    coefficient filtering.
  • Powerful clock management tiles (CMT), combining phase-locked
    loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
    precision and low jitter.
  • Integrated block for PCI Express (PCIe), for up to x8 Gen3
    Endpoint and Root Port designs.
  • Wide variety of configuration options, including support for
    commodity memories, 256-bit AES encryption with HMAC/SHA-256
    authentication, and built-in SEU detection and correction.
  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip
    packaging offering easy migration between family members in
    the same package. All packages available in Pb-free and selected
    packages in Pb option.
  • Designed for high performance and lowest power with 28 nm,
    HKMG, HPL process, 1.0V core voltage process technology and
    0.9V core voltage option for even lower power.

Technical Attributes

Find Similar Parts
Description Value
No. of Pins 324
IC Mounting Surface Mount
Operating Temperature Max 85
Speed Grade 1
No. of User I/Os 150
IC Case / Package CSBGA
No. of Logic Cells 23

ECCN / UNSPSC / COO

Description Value
ECCN: EAR99
SCHEDULE B: 8472909002
HTSN: 8472909080
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