IS45S16800F-7BLA2 by ISSI DRAMs | Avnet Asia Pacific

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IS45S16800F-7BLA2

DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TFBGA

ISSI
Manufacturer: ISSI
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: IS45S16800F-7BLA2
RoHS 6 Compliant
NCNR
Obsolete

The 128Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 3.3V Vdd and 3.3V Vddq memory systems containing 134,217,728 bits. Internally configured as a quad-bank DRAM with a synchronous interface. Each 33,554,432-bit bank is organized as 4,096 rows by 512 columns by 16 bits. The 128MbS DRAM includes an AUTOREFRESH MODE, and a power-saving, power-down mode. All signals are registered on the positive edge of the clock signal, CLK. All inputs and outputs are LVTTL compatible. The 128Mb SDRAM has the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time and the capability to randomly change column addresses on each clock cycle during burst access. A self-timed row precharge initiated at the end of the burst sequence is available with the AUTOPRECHARGE function enabled. Precharge one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed, random-access operation. SDRAM read and write accesses are burst oriented starting at a selected location and continuing for a programmed number of locations in a programmed sequence. The registration of an ACTIVE command begins accesses, followed by a READ or WRITE command. The ACTIVE command in conjunction with address bits registered are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A11 select the row). The READ or WRITE commands in conjunction with address bits registered are used to select the starting column location for the burst access. Programmable READ or WRITE burst lengths consist of 1, 2, 4 and 8 locations or full page, with a burst terminate option.

Key Features

  • Clock frequency: 200, 166, 143 MHz
  • Fully synchronous; all signals referenced to a positive clock edge Organization 16Mx8
  • Internal bank for hiding row access/precharge
  • Power supply: Vdd 3.3V Vddq 3.3V
  • LVTTL interface
  • Programmable burst length -(1, 2, 4, 8, full page)
  • Programmable burst sequence: Sequential/Interleave
  • Auto Refresh (CBR)
  • Self Refresh
  • 4096 refresh cycles every 16 ms (A2 grade) or 64 ms (A1 grade)
  • Random column address every clock cycle
  • Programmable CAS latency (2, 3 clocks)
  • Burst read/write and burst read/single write operations capability
  • Burst termination by burst stop and precharge command
  • Temperature Ranges: Automotive and A1 (-40°C to +85°C) Automotive, A2 (-40°C to +105°C)
  • Package-54-pin TSOPII, 54-ball BGA.

Technical Attributes

Find Similar Parts
Description Value
Density 128 Mbit
Number of Bits per Word 16 Bit
Maximum Clock Rate 143 MHz
Operating Temperature -40 to 105 °C
Operating Temperature Min -40 °C
Max Processing Temp 260
Clock Frequency Max 143 MHz
Lead Finish Tin-Silver-Copper
Supplier Package TFBGA
No. of Pins 54
IC Mounting Surface Mount
IC Case / Package TFBGA
Memory Density 128 Mbit
Operating Supply Voltage 3.3 V
Address Bus Width 12 Bit
Number of I/O Lines 16 Bit
Screening Level Automotive
Organization 8M x 16
Maximum Operating Current 80 mA
Maximum Random Access Time 5.4 ns
Product Dimensions 8 x 8 x 0.8(Max)
MSL Level MSL 3 - 168 hours
Number of Banks 4
Pin Count 54
Type SDRAM
Mounting Surface Mount
Supply Voltage Nom 3.3 V
Memory Configuration 8M x 16
Operating Temperature Max 105 °C
Data Bus Width 16 Bit

ECCN / UNSPSC / COO

Description Value
ECCN: 3A991.b.1.a
SCHEDULE B: 8542320015
HTSN: 8542320002
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