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Third generation power MOSFETs from Vishay provide the designer with the best combinations of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The D2PAK is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability and the last lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version (IRF640L/SiHF640L) is available for low-profile applications.
Key Features
|
Description | Value |
---|---|---|
|
Rds(on) Test Voltage | 10 |
|
Operating Temperature Max | 150 |
|
No. of Pins | 3 |
|
Transistor Mounting | Surface Mount |
|
Continuous Drain Current Id | 18 |
|
Drain Source On State Resistance | 180 |
|
Power Dissipation | 130 |
|
Drain Source Voltage Vds | 200 |
|
Transistor Case Style | TO-263AB |
|
Channel Type | N |
|
Product Range | IRF Series |
|
MSL Level | MSL 1 - Unlimited |
Description | Value |
---|---|
ECCN: | EAR99 |
SCHEDULE B: | 8541290080 |
HTSN: | 8541290095 |
Documents
Title | Download | Type | Date Published |
---|---|---|---|
retraction as all parts are still available and active | EOL-Documentation | 20201030 |