Manufacturer:
Kingston Technology
D2516ECMDXGJD-U
DRAM Chip DDR3L SDRAM 4Gbit 256M X 16 1.35V 96-Pin FBGA
Avnet Manufacturer Part #:
D2516ECMDXGJD-U
RoHS 6 Compliant
Kingston on-board DRAM is designed to meet the needs of embedded applications and offers a low-voltage option for lower power consumption.
Key Features
- Double-data-rate architecture: two data transfers per clock cycle
- The high-speed data transfer is realized by the 8 bits prefetch pipelined architecture
- Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver
- DOS is edge-aligned with data for READS; center-aligned with data for WRITES
- Differential clock inputs (CK and !CK)
- DLL aligns DQ and DOS transitions with CK transitions
- Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
- Data mask (DM) for write data
- Posted /CAS by programmable additive latency for better command and data bus efficiency
- On-Die Termination (ODD for better signal quality)
- Synchronous ODT
- Dynamic CDT
- Asynchronous ODT
- Multi Purpose Register (MPR) for pre-defined pattern read out
- ZQ calibration for DO drive and ODT
- Programmable Partial Array Self-Refresh (PASR)
- RESET pin for Power-up sequence and reset function
- SRT range: Normal/extended
- Programmable Output driver impedance control
Technical Attributes
Find Similar Parts|
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Description | Value |
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IC Mounting | Surface Mount |
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IC Case / Package | FBGA |
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Clock Frequency Max | 933 MHz |
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Memory Density | 4 Gbit |
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Operating Temperature Max | 95 °C |
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Operating Temperature Min | 0 °C |
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Memory Configuration | 256M x 16bit |
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DRAM Type | DDR3L SDRAM |
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No. of Pins | 96 |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| ECCN: | 3A991.b.1.a |
| SCHEDULE B: | 8523510000 |