W9825G6KH-6I by Winbond DRAMs | Avnet Asia Pacific

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W9825G6KH-6I

DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II

W9825G6KH-6I in DRAMs by Winbond
Winbond
Manufacturer: Winbond
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: W9825G6KH-6I
RoHS 10 Compliant

The W9825G6KH is a high-speed synchronous dynamic random access memory (SDRAM), organized as 4M words x 4 banks x 16 bits. W9825G6KH delivers a data bandwidth of up to 200M words per second. To fully comply with the personal computer industrial standard, W9825G6KH is sorted into the following speed grades: -5, -5I, -6, -6I, -6L -75 and 75L. The -5/-5I grade parts are compliant to the 200 MHz/CL3 specification (the -5I industrial grade which is guaranteed to support - 40°C ≤ TA ≤ 85°C). The -6/-6I/-6L grade parts are compliant to the 166MHz/CL3 specification (the -6I industrial grade which is guaranteed to support - 40°C ≤ TA ≤ 85°C). The -75/75L is compliant to the 133MHz/CL3 specification. The -6L and 75L parts support self refresh current IDD6 Max. 1.5 mA.

Accesses to the SDRAM are burst oriented. Consecutive memory location is one page can be accessed at a burst length of 1, 2, 4, 8 or full page when a bank and row is selected by an ACTIVE command. Column addresses are automatically generated by the SDRAM internal counter in burst operation. Random column read is also possible by providing its address at each clock cycle. The multiple bank nature enables interleaving among internal banks to hide the pre-charging time.

Key Features

  • 3.3V ± 0.3V Power Supply
  • Up to 200 MHz Clock Frequency
  • 4,194,304 Words x 4 Banks x 16 Bits Organization
  • Self Refresh Mode: Standard and Low Power
  • CAS Latency: 2 and 3
  • Burst Length: 1, 2, 4, 8 and Full Page
  • Burst Read, Single Writes Mode
  • Byte Data Controlled by LDQM, UDQM
  • Power Down Mode
  • Auto-precharge and Controlled Precharge
  • 8K Refresh Cycles/64 mS
  • Interface: LVTTL
  • Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant

Technical Attributes

Find Similar Parts
Description Value
IC Case / Package TSOP-II
Data Bus Width 16 Bit
Density 256 Mbit
Number of Bits per Word 16 Bit
Maximum Clock Rate 166 MHz
Address Bus Width 13 Bit
IC Mounting Surface Mount
Supplier Package TSOP-II
Screening Level Industrial
No. of Pins 54
Number of I/O Lines 16 Bit
Operating Temperature Max 85 °C
Mounting Surface Mount
Pin Count 54
Type SDRAM
Max Processing Temp 260 °C
Operating Temperature Min -40 °C
Number of Banks 4 m
Maximum Operating Current 60 mA
Operating Supply Voltage 3.3000 V
Organization 16M x 16
Operating Temperature -40 to 85 °C
Maximum Random Access Time 5|6 ns
Memory Configuration 16M x 16bit
Memory Density 256 Mbit
Clock Frequency Max 166 MHz
Product Dimensions 22.22 x 10.16 x 1 mm
DRAM Type SDRAM

ECCN / UNSPSC / COO

Description Value
ECCN: EAR99
SCHEDULE B: 85423290
HTSN: 85423290
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