AT45DB081E-SSHN-T by Renesas Electronics Flash Memory | Avnet Asia Pacific

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AT45DB081E-SSHN-T

Flash Serial-SPI 2.5V/3.3V 8Mbit 8M x 1bit 8-Pin SOIC T/R

AT45DB081E-SSHN-T in Flash Memory by Renesas Electronics
Renesas Electronics
Manufacturer: Renesas Electronics
Product Category: Memory, Flash Memory
Avnet Manufacturer Part #: AT45DB081E-SSHN-T
RoHS 10 Compliant

The AT45DB081E is a 1.7V minimum, serial-interface sequential access Flash memory ideally suited for a wide variety ofdigital voice, image, program code, and data storage applications. The AT45DB081E also supports the RapidS serialinterface for applications requiring very high speed operation. Its 8,650,752 bits of memory are organized as 4,096 256 bytes or 264 bytes each. In addition to the main memory, the AT45DB081E also contains two SRAM buffers of256/264 bytes each. The buffers allow receiving of data while main memory is being reprogrammed.Interleaving between both buffers can dramatically increase a system's ability to write a continuous data stream. Inaddition, the SRAM buffers can be used as additional system scratch pad memory, and E2PROM emulation (bit or bytealterability) can be easily handled with a self-contained three step read-modify-write operation.Unlike conventional Flash memories that are accessed randomly with multiple address lines and a parallel interface, theDataFlash uses a serial interface to sequentially access its data. The simple sequential access dramatically reducesactive pin count, facilitates simplified hardware layout, increases system reliability, minimizes switching noise, andreduces package size. The device is optimized for use in many commercial and industrial applications wherehigh-density, low-pin count, low-voltage, and low-power are essential.To allow for simple in-system re-programmability, the AT45DB081E does not require high input voltages forprogramming. The device operates from a single 1.7V to 3.6V power supply for the erase and program and readoperations. The AT45DB081E is enabled through the Chip Select pin (CS) and accessed via a 3-wire interface consistingof the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK).All programming and erase cycles are self-timed.

Key Features

  • Single 1.7V - 3.6V supply
  • Serial Peripheral Interface (SPI) compatible
  • Supports SPI modes 0 and 3
  • Supports RapidS™ operation
  • Continuous read capability through entire array
  • Up to 85MHz
  • Low-power read option up to 15MHz
  • Clock-to-output time (tV) of 6ns maximum
  • User configurable page size
  • 256 bytes per page
  • 264 bytes per page (default)
  • Page size can be factory pre-configured for 256 bytes
  • Two fully independent SRAM data buffers (256/264 bytes)
  • Allows receiving data while reprogramming the main memory array
  • Flexible programming options
  • Byte/Page Program (1 to 256/264 bytes) directly into main memory
  • Buffer Write
  • Buffer to Main Memory Page Program
  • Flexible erase options
  • Page Erase (256/264 bytes)
  • Block Erase (2KB)
  • Sector Erase (64KB)
  • Chip Erase (8-Mbits)
  • Program and Erase Suspend/Resume
  • Advanced hardware and software data protection features
  • Individual sector protection
  • Individual sector lockdown to make any sector permanently read-only
  • 128-byte, One-Time Programmable (OTP) Security Register
  • 64 bytes factory programmed with a unique identifier
  • 64 bytes user programmable
  • Hardware and software controlled reset options
  • JEDEC Standard Manufacturer and Device ID Read
  • Low-power dissipation
  • 400nA Ultra-Deep Power-Down current (typical)
  • 4.5µA Deep Power-Down current (typical)
  • 25µA Standby current (typical)
  • 11mA Active Read current (typical at 20MHz)
  • Endurance: 100,000 program/erase cycles per page minimum
  • Data retention: 20 years
  • Complies with full industrial temperature range
  • Green (Pb/Halide-free/RoHS compliant) packaging options
  • 8-lead SOIC (0.150" wide and 0.208" wide)
  • 8-pad Ultra-thin DFN (5 x 6 x 0.6mm)
  • Die in Wafer Form

Technical Attributes

Find Similar Parts
Description Value
Operating Temperature Max 85 °C
IC Case / Package SOIC N
Access Time 7 ns
Operating Temperature Min -40 °C
Memory Density 8 Mbit
Supply Voltage Max 3.6 V
Clock Frequency Max 133 MHz
Product Range 1.8V, 3V Serial NOR Flash Memories
Memory Configuration 1M x 8bit
Flash Memory Type Serial NOR
Interfaces SPI
IC Mounting Surface Mount
No. of Pins 8
Supply Voltage Nom 3, 3.3 V
Supply Voltage Min 1.7 V

ECCN / UNSPSC / COO

Description Value
ECCN: EAR99
SCHEDULE B: 8542320050
HTSN: 8542320051
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