Manufacturer:
Micron
Product Category:
Memory,
Flash Memory
Inactivity Warning Dialog
Key Features
|
Description | Value |
---|---|---|
|
Lead Finish | Tin-Silver-Copper |
|
Access Time | 25 ns |
|
Maximum Operating Current | 35 mA |
|
Mounting | Surface Mount |
|
Memory Configuration | 256M x 8bit |
|
Flash Memory Type | SLC NAND |
|
Memory Density | 2 Gbit |
|
Pin Count | 63 |
|
Product Range | 3.3V SLC NAND Flash Memories |
|
Product Dimensions | 9 x 11 x 0.75(Max) mm |
|
Operating Temperature | -40 to 85 °C |
|
Operating Temperature Min | -40 |
|
Supplier Package | VFBGA |
|
Operating Temperature Max | 85 |
|
IC Case / Package | VFBGA |
|
Screening Level | Industrial |
|
Typical Operating Supply Voltage | 3.3000 V |
|
Density | 2 Gbit |
|
Programming Voltage | 2.7 to 3.6 V |
|
Program Current | 20 mA |
|
Maximum Operating Supply Voltage | 3.6 V |
|
Timing Type | Asynchronous |
|
Maximum Programming Time | 0.6/Page ms |
|
ECC Support | Yes |
|
Maximum Random Access Time | 25 ns |
|
Minimum Operating Supply Voltage | 2.7 V |
|
Architecture | Sectored |
|
Interface Type | Parallel |
|
Erase Suspend/Resume Modes Support | No |
|
Supply Voltage Nom | 3.3 V |
|
Number of Words | 256 MWords |
|
Number of Bits per Word | 8 Bit |
|
Block Organization | Symmetrical |
Description | Value |
---|---|
ECCN: | 3A991.a.1 |
SCHEDULE B: | PARTS... |
HTSN: | PARTS... |