IS25LP256D-RMLE-TR by ISSI Flash Memory | Avnet Asia Pacific

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IS25LP256D-RMLE-TR

NOR Flash Serial SPI 2.5V/3.3V 256Mbit 32M X 8bit 7ns/8ns 16-Pin SOIC

IS25LP256D-RMLE-TR in Flash Memory by ISSI
ISSI
Manufacturer: ISSI
Product Category: Memory, Flash Memory
Avnet Manufacturer Part #: IS25LP256D-RMLE-TR
RoHS 10 Compliant

The IS25LP256D and IS25WP256D Serial Flash memory offers a versatile storage solution with high flexibility and performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” Flash is for systems that require limited space, a low pin count, and low power consumption. The device is accessed through a 4-wire SPI Interface consisting of a Serial Data Input (SI), Serial Data Output (SO), Serial Clock (SCK), and Chip Enable (CE#) pins, which can also be configured to serve as multi-I/O (see pin descriptions).

The device supports Dual and Quad I/O as well as standard, Dual Output, and Quad Output SPI. Clock frequencies of up to 166MHz allow for equivalent clock rates of up to 664MHz (166MHz x 4) which equates to 83Mbytes/s of data throughput. The IS25xP series of Flash adds support for DTR (Double Transfer Rate) commands that transfer addresses and read data on both edges of the clock. These transfer rates can outperform 16-bit Parallel Flash memories allowing for efficient memory access to support XIP (execute in place) operation.

The memory array is organized into programmable pages of 256 bytes. This family supports page program mode where 1 to 256 bytes of data are programmed in a single command. QPI (Quad Peripheral Interface) supports 2- cycle instruction further reducing instruction times. Pages can be erased in groups of 4Kbyte sectors, 32Kbyte blocks, 64Kbyte blocks, and/or the entire chip. The uniform sector and block architecture allows for a high degree of flexibility so that the device can be utilized for a broad variety of applications requiring solid data retention.



Key Features

  • Industry Standard Serial Interface
    • IS25LP256D: 256Mbit/32Mbyte
    • IS25WP256D: 256Mbit/32Mbyte
    • 3 or 4 Byte Addressing Mode
    • Supports Standard SPI, Fast, Dual, Dual I/O, Quad, Quad I/O, SPI DTR, Dual I/O DTR, Quad I/O DTR, and QPI
    • Software & Hardware Reset
    • Supports Serial Flash Discoverable Parameters (SFDP)
  • High Performance Serial Flash (SPI)
    • 80MHz Normal Read
    • Up to166Mhz Fast Read:
      • -166MHz at Vcc=2.7V to 3.6V (1)
      • -133MHz at Vcc=2.3V to 3.6V
      • 104MHz at Vcc=1.65V to 1.95V
    • Up to 80MHz DTR (Dual Transfer Rate)
    • Equivalent Throughput of 664 Mb/s
    • Selectable Dummy Cycles
    • Configurable Drive Strength
    • Supports SPI Modes 0 and 3
    • More than 100,000 Erase/Program Cycles
    • More than 20-year Data Retention
  • Flexible & Efficient Memory Architecture
    • Chip Erase with Uniform Sector/Block Erase (4/32/64 Kbyte)
    • Program 1 to 256 Byte per Page
    • Program/Erase Suspend & Resume
  • Efficient Read and Program modes
    • Low Instruction Overhead Operations
    • Continuous Read 8/16/32/64 Byte Burst Wrap
    • Selectable Burst Length
    • QPI for Reduced Instruction Overhead
    • AutoBoot Operation
  • Low Power with Wide Temp. Ranges
    • Single Voltage Supply IS25LP: 2.30V to 3.60V IS25WP: 1.65V to 1.95V
    • 7.5 mA Active Read Current
    • - 10 µA Standby Current
    • 1 µA Deep Power Down
    • Temp Grades:
      • Extended: -40°C to +105°C
      • Auto Grade (A3): 40°C to +125°C
  • Advanced Security Protection
    • Software and Hardware Write Protection
    • Advanced Sector/Block Protection
    • Top/Bottom Block Protection
    • Power Supply Lock Protection
    • 4x256 Byte Dedicated Security Area with OTP User-lockable Bits
    • 128 bit Unique ID for Each Device (Call Factory)
  • Industry Standard Pin-out & Packages
    • M =16-pin SOIC 300mil
    • L = 8-contact WSON 8x6mm
    • G = 24-ball TFBGA (4x6 ball array)
    • H = 24-ball TFBGA (5x5 ball array)
    • KGD (Call Factory)

Technical Attributes

Find Similar Parts
Description Value
Operating Temperature Min -40 °C
No. of Pins 16
Access Time 8 ns
Interfaces 4-Wire, DTR, QPI, SPI
IC Mounting Surface Mount
IC Case / Package SOIC
Memory Density 256 Mbit
Clock Frequency Max 166 MHz
Supply Voltage Max 3.6 V
Operating Temperature Max 105 °C
Supply Voltage Min 2.3 V
Supply Voltage Nom 3, 3.3 V
Flash Memory Type NOR

ECCN / UNSPSC / COO

Description Value
ECCN: 3A991.b.1.a
SCHEDULE B: 8542320070
HTSN: 8542320071
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